发明申请
- 专利标题： Process for manufacturing multilayer flexible wiring boards
- 专利标题（中）： 多层柔性布线板制造工艺
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申请号： US10423978申请日： 2003-04-28
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公开(公告)号： US20050028358A1公开(公告)日： 2005-02-10
- 发明人: Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
- 申请人： Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
- 专利权人： SONY CHEMICALS CORP.
- 当前专利权人： SONY CHEMICALS CORP.
- 优先权： JPHEI11-239358 19990826; JPHEI11-246954 19990901; JPHEI11-246963 19990901
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K3/00 ; H05K3/28 ; H05K3/42 ; H05K3/46 ; H05K1/11
摘要：
The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
公开/授权文献
- US06991148B2 Process for manufacturing multilayer flexible wiring boards 公开/授权日：2006-01-31
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