Invention Application
- Patent Title: Method and device for applying material to a workpiece
- Patent Title (中): 将材料施加到工件上的方法和装置
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Application No.: US10398785Application Date: 2001-10-02
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Publication No.: US20050031776A1Publication Date: 2005-02-10
- Inventor: Elke Zakel , Paul Kasulke , Oliver Uebel , Lars Titerle
- Applicant: Elke Zakel , Paul Kasulke , Oliver Uebel , Lars Titerle
- Priority: DE10049585.0 20001006
- International Application: PCT/EP01/11419 WO 20011002
- Main IPC: B23K3/06
- IPC: B23K3/06 ; H05K3/34 ; B05D5/00 ; B05D5/12
Abstract:
In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compressed gas. As soon as the tip (12) of the capillary approaches the workpiece (1), the dynamic pressure increases and is used as a measure for the distance between the tip (12) of the capillary (3) and the workpiece (1), enabling the feed motion of the capillary to be controlled.
Public/Granted literature
- US07121449B2 Method and device for applying material to a workpiece Public/Granted day:2006-10-17
Information query
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