- 专利标题: Adhesive bonds for metalic bipolar plates
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申请号: US10635123申请日: 2003-08-06
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公开(公告)号: US20050031933A1公开(公告)日: 2005-02-10
- 发明人: Richard Blunk , Mahmoud Abd Elhamid , Daniel Lisi , Youssef Mikhail , Michael Budinski
- 申请人: Richard Blunk , Mahmoud Abd Elhamid , Daniel Lisi , Youssef Mikhail , Michael Budinski
- 主分类号: H01M2/08
- IPC分类号: H01M2/08 ; H01M8/00 ; H01M8/02 ; H01M8/04 ; H04M1/64 ; H04M11/04
摘要:
The present invention relates to an electrically conductive element (e.g. bipolar plate) for a fuel cell which has an improved adhesive bond. The conductive element generally comprises a first and a second conductive sheet, each having a surface that confront one another. The surfaces that confront one another are overlaid with an electrically conductive primer coating providing corrosion protection and low contact resistance to said first and said second sheets respectively in regions where the first and second sheets contact one another. The first and said second coated surfaces are joined to one another by an electrically conductive adhesive which provides adhesion of said first and said second coated surfaces of said sheets at the contact region. Further, the present invention contemplates methods to form such an improved bond in an electrically conductive element.
公开/授权文献
- US06942941B2 Adhesive bonds for metalic bipolar plates 公开/授权日:2005-09-13
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