A process for producing an integrated electronic circuit that includes a capacitor comprises the formation of a stack on top of a substrate (100, 101). The stack comprises a first volume of a temporary material, a second volume (2) of at least one insulating dielectric and a third volume (3) of a first electrically conducting material. After a coating material (4) has been deposited on the stack, the temporary material is removed via access shafts (C1, C2) that are formed between a surface (S) of the circuit and the first volume. The temporary material is then replaced with a second, electrically conducting material.