Invention Application
- Patent Title: Low polydispersity resin, and preparation thereof
- Patent Title (中): 低分散性树脂及其制备方法
-
Application No.: US10714052Application Date: 2003-11-14
-
Publication No.: US20050032997A1Publication Date: 2005-02-10
- Inventor: Ting-Yu Lee , Choa-Ying Yu , Meei-Yu Hsu , Shian-Jy Wang , Ching Ting , Kuo-Chen Shih
- Applicant: Ting-Yu Lee , Choa-Ying Yu , Meei-Yu Hsu , Shian-Jy Wang , Ching Ting , Kuo-Chen Shih
- Priority: TW92121346 20030805
- Main IPC: C08F2/00
- IPC: C08F2/00 ; C08F2/38 ; C08F220/10

Abstract:
A resin with low polydispersity index and a process for preparing the same. The process includes polymerizing at least one monomer with an initiator and a chain transfer reagent, wherein the monomer is an acrylate monomer having at least one ethylenically unsaturated bonds or norbornene derivatives. Furthermore, a photoresist composition containing the resin composition according to the present invention can increase pattern resolution in lithography process.
Information query