发明申请
- 专利标题： Encapsulated component which is small in terms of height and method for producing the same
- 专利标题（中）： 高度小的密封部件及其制造方法
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申请号： US10500371申请日： 2002-12-11
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公开(公告)号： US20050034888A1公开(公告)日： 2005-02-17
- 发明人: Christian Hoffmann , Jurgen Portmann , Hans Krueger
- 申请人： Christian Hoffmann , Jurgen Portmann , Hans Krueger
- 优先权： DE10164494.9 20011228
- 国际申请： PCT/DE02/04535 WO 20021211
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L29/06 ; H03H3/02 ; H03H3/06 ; H03H3/08 ; H03H9/02 ; H03H9/05 ; H03H9/10 ; H03H9/25 ; H03H9/56 ; H01L23/02
摘要：
For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.
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