公开(公告)号：US20050034888A1

公开(公告)日：2005-02-17

申请号：US10500371

申请日：2002-12-11

申请人： Christian Hoffmann ,  Jurgen Portmann ,  Hans Krueger

发明人： Christian Hoffmann ,  Jurgen Portmann ,  Hans Krueger

IPC分类号： H01L23/12 ,  H01L29/06 ,  H03H3/02 ,  H03H3/06 ,  H03H3/08 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H03H9/56 ,  H01L23/02

CPC分类号： H03H9/1078 ,  H01L24/31 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/83136 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H03H9/059 ,  H01L2924/0105 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.

摘要翻译： 为了更简单和更安全地封装组件，建议通过沉积在载体衬底上的凹陷中的凸块连接来产生芯片和载体衬底之间的连接。 因此，该部件直接位于载体基板上，特别是在限定芯片上的部件结构的框架上。

公开(公告)号：US06982380B2

公开(公告)日：2006-01-03

申请号：US10500371

申请日：2002-12-11

申请人： Christian Hoffmann ,  Jürgen Portmann ,  Hans Krueger

发明人： Christian Hoffmann ,  Jürgen Portmann ,  Hans Krueger

IPC分类号： H01L23/28 ,  H05K5/06

CPC分类号： H03H9/1078 ,  H01L24/31 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/83136 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H03H9/059 ,  H01L2924/0105 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.

摘要翻译： 为了更简单和更安全地封装组件，建议通过沉积在载体衬底上的凹陷中的凸块连接来产生芯片和载体衬底之间的连接。 因此，该部件直接位于载体基板上，特别是在限定芯片上的部件结构的框架上。

公开(公告)号：US09620266B2

公开(公告)日：2017-04-11

申请号：US14131559

申请日：2012-07-04

申请人： Markus Ortner ,  Michael Schossmann ,  Markus Koini ,  Günter Engel ,  Christian Hoffmann

发明人： Markus Ortner ,  Michael Schossmann ,  Markus Koini ,  Günter Engel ,  Christian Hoffmann

IPC分类号： H01G4/232 ,  H01C1/148 ,  H01C1/01 ,  H01C7/02 ,  H01C7/04 ,  H01C7/10 ,  H01G4/248 ,  H01G4/30 ,  H01C7/00 ,  H01G2/06

CPC分类号： H01C1/148 ,  H01C1/01 ,  H01C7/008 ,  H01C7/02 ,  H01C7/04 ,  H01C7/10 ,  H01G2/06 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30

摘要： An electrical device having at least one functional element that includes a ceramic body, on which a first electrical contact layer and a second electrical contact layer are applied to two opposite-lying side faces, respectively, and the functional element is arranged between a first contact strip and a second contact strip, wherein the first contact strip and the second contact strip comprise several contact pins, respectively, and wherein the first contact layer electrically contacts at least one contact pin of the first contact strip and the second contact layer electrically contacts at least one contact pin of the second contact strip.

公开(公告)号：US09532454B2

公开(公告)日：2016-12-27

申请号：US12159809

申请日：2007-01-03

申请人： Christian Block ,  Pavol Dudesek ,  Thomas Feichtinger ,  Christian Hoffmann ,  Guenter Pudmich

发明人： Christian Block ,  Pavol Dudesek ,  Thomas Feichtinger ,  Christian Hoffmann ,  Guenter Pudmich

IPC分类号： B32B18/00 ,  C04B35/46 ,  B32B17/00 ,  B32B5/00 ,  C03C3/00 ,  H05K1/16 ,  H01C1/14 ,  H01C7/18 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40 ,  H01L21/48 ,  H01L23/498 ,  H01L23/552 ,  H01F10/20 ,  H01F17/00 ,  H01L25/16 ,  H03H1/00 ,  H05K1/03 ,  H05K3/46 ,  H01F10/26

CPC分类号： H01F27/2804 ,  B32B18/00 ,  B32B37/06 ,  B32B37/18 ,  B32B38/0036 ,  B32B38/145 ,  B32B2255/205 ,  B32B2264/101 ,  B32B2264/107 ,  B32B2264/12 ,  B32B2305/77 ,  B32B2305/80 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/704 ,  B32B2457/16 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/366 ,  C04B2237/564 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01C1/14 ,  H01C7/008 ,  H01C7/10 ,  H01C7/18 ,  H01C17/06 ,  H01F10/20 ,  H01F10/265 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/32 ,  H01F41/041 ,  H01F41/12 ,  H01F2027/2809 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/552 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H2001/0085 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  Y10T428/265 ,  H01L2924/00

摘要： A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and a second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.

摘要翻译： 公开了一种由压实的绿色薄膜制成并且能够被烧结以形成具有整体多层结构的陶瓷部件的薄膜叠层。 薄膜叠层包括功能层，其功能层包括包含功能性陶瓷的绿膜和包含包含电介质材料的绿膜的张力层。 张力层与多层结构中的功能层直接相邻。 多层结构还包括第一金属化平面和第二金属化平面。 功能层位于第一金属化平面和第二金属化平面之间。

公开(公告)号：US09378892B2

公开(公告)日：2016-06-28

申请号：US13575256

申请日：2011-01-25

申请人： Guenter Engel ,  Christian Hoffmann ,  Andrea Testino

发明人： Guenter Engel ,  Christian Hoffmann ,  Andrea Testino

IPC分类号： H01G4/06 ,  H01G4/228 ,  H01G4/30 ,  H02M3/06 ,  H01G4/38 ,  H01C7/04 ,  H01G4/12

CPC分类号： H01G4/38 ,  H01C7/04 ,  H01G4/1218 ,  H01G4/1236 ,  H01G4/30

摘要： A ceramic multilayer capacitor includes a first capacitor unit, which comprises a first material, and a second capacitor units, which comprises a second material. The first and the second capacitor unit are electrically connected in parallel. At low applied voltages, the first material has a high dielectric value and, at high applied voltages the second material has a high dielectric value.

摘要翻译： 陶瓷层叠电容器包括第一电容器单元，其包括第一材料，第二电容器单元包括第二材料。 第一和第二电容器单元并联电连接。 在低施加电压下，第一材料具有高介电值，并且在高施加电压下，第二材料具有高介电值。

公开(公告)号：US09054310B2

公开(公告)日：2015-06-09

申请号：US13823105

申请日：2011-09-16

申请人： Christian Hoffmann ,  Yongli Wang

发明人： Christian Hoffmann ,  Yongli Wang

IPC分类号： C04B35/00 ,  H01L41/187 ,  C04B35/462 ,  C04B35/475 ,  C04B35/49 ,  C04B35/626 ,  C04B35/638 ,  H01L41/43

CPC分类号： H01L41/1878 ,  C04B35/462 ,  C04B35/475 ,  C04B35/49 ,  C04B35/62655 ,  C04B35/62675 ,  C04B35/638 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3232 ,  C04B2235/3298 ,  C04B2235/442 ,  C04B2235/656 ,  C04B2235/72 ,  C04B2235/768 ,  H01L41/1873 ,  H01L41/43

摘要： A ceramic material having the general formula (BiXNayM zLuM V w) (Ti1-sZs)03, where: M comprises at least one element of main group 1, M comprises at least one element of main group 2, L comprises at least one element of the lanthanides, V is a vacancy and Z is selected from among Zr, Hf and combinations thereof, is provided. Furthermore, a piezoelectric actuator comprising the ceramic material and a process for producing the ceramic material are provided.

摘要翻译： 具有通式（BiXNayM 1 zLuM 2 V V w）（Ti 1-s Z s）O 3）的陶瓷材料，其中：M 1包含主族1的至少一个元素，M 2包括 主要组2的至少一个元素，L包含至少一种镧系元素，V是空位，Z选自Zr，Hf及其组合。 此外，提供了包括陶瓷材料的压电致动器和用于制造陶瓷材料的方法。

公开(公告)号：US20130177137A1

公开(公告)日：2013-07-11

申请号：US13737855

申请日：2013-01-09

申请人： Richard Eichhorn ,  Christian Hoffmann ,  Jan Matschulla ,  Gia Khanh Pham

发明人： Richard Eichhorn ,  Christian Hoffmann ,  Jan Matschulla ,  Gia Khanh Pham

IPC分类号： H01J35/16

CPC分类号： H01J35/16 ,  H01J35/165 ,  H01J35/26 ,  Y10T156/1043

摘要： An X-ray tube includes a vacuum-filled housing and an anode contained in the vacuum-filled housing. The anode is operable to produce an X-ray beam based on electrons emitted from a cathode and attracted by a high voltage applied to the anode. The X-ray tube also includes a high-voltage power line introduced from an external side of the housing for supplying the anode with a high-voltage potential. The X-ray tube includes an electrical feed for electrically insulating the high-voltage power line from the housing. The electrical feed in the X-ray tube includes at least two insulating layers radially between the high-voltage power line and the housing. The at least two insulating layers are separated from one another by a metallic coating.

摘要翻译： X射线管包括真空填充的壳体和包含在真空填充的壳体中的阳极。 阳极可操作以产生基于从阴极发射的电子并被施加到阳极的高电压吸引的X射线束。 X射线管还包括从外壳的外侧引入的用于向阳极供应高电位电位的高压电力线。 X射线管包括用于将高压电力线与壳体电绝缘的电源。 X射线管中的馈电在高压电源线和壳体之间径向包括至少两个绝缘层。 所述至少两个绝缘层通过金属涂层彼此分开。

公开(公告)号：US08012357B2

公开(公告)日：2011-09-06

申请号：US11060004

申请日：2005-02-17

申请人： Benjamin C. Fuchs ,  Christian Hoffmann ,  Karsten Keller ,  Christopher M. Rey

发明人： Benjamin C. Fuchs ,  Christian Hoffmann ,  Karsten Keller ,  Christopher M. Rey

IPC分类号： B01D35/06 ,  B03C1/30

CPC分类号： B01D35/06 ,  B01D37/00 ,  B03C1/034 ,  B03C1/30 ,  B03C2201/18

摘要： This invention relates to a continuous or batch centrifugation solid-liquid separation process comprising simultaneously subjecting the solid-liquid mixture to localized magnetic field gradients and the centrifugation and to improved centrifugation solid-liquid separation processes wherein the improvement comprises simultaneously subjecting the solid-liquid mixture to a homogeneous magnetic field, a magnetic field gradient or both prior to and/or during the centrifugation.

摘要翻译： 本发明涉及连续或分批离心固液分离方法，其包括将固液混合物同时经受局部磁场梯度和离心分离和改进的离心固液分离方法，其中改进包括将固液混合物 到离心之前和/或期间的均匀磁场，磁场梯度或两者。

公开(公告)号：US07454178B2

公开(公告)日：2008-11-18

申请号：US11272596

申请日：2005-11-14

申请人： Christian Block ,  Holger Flühr ,  Christian Hoffmann

发明人： Christian Block ,  Holger Flühr ,  Christian Hoffmann

IPC分类号： H04B1/02

CPC分类号： H04B1/0483 ,  H03H7/0138 ,  H04B1/0458 ,  H04B1/48 ,  H04B1/54

摘要： A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.

摘要翻译： 具有设置在输入侧的具有功率放大器的至少一个传输路径的无线传输系统的发射机模块包括设置在输出侧的低通滤波器和设置在其间的阻抗转换器。 因此，功率放大器和低通滤波器设置在多层载体衬底的顶表面上。 优选地，阻抗转换器设置在载体衬底的金属化平面中。 本发明将所有这些组件集成在一个模块中特别允许低阻抗放大器输出与具有确定的输出阻抗（例如50欧姆）的发射机模块的输出之间的逐步阻抗适配，由此阻抗适配 部分由低通滤波器进行。 多级阻抗适配允许减少例如在阻抗转换器中使用的线路段的长度和所涉及的信号损耗。

公开(公告)号：US07224573B2

公开(公告)日：2007-05-29

申请号：US10363221

申请日：2001-08-03

申请人： Helmut Sommariva ,  Christian Hoffmann ,  Matiaz Valant ,  Danilo Suvorov

发明人： Helmut Sommariva ,  Christian Hoffmann ,  Matiaz Valant ,  Danilo Suvorov

IPC分类号： H01G4/06

CPC分类号： H01G4/1254 ,  C04B35/495

摘要： A capacitor includes at least two pairs of opposing electrode layers and an intermediate dielectric layer. The intermediate dielectric layer includes a ceramic material that contains at least two different components existing in separate phases. The at least two different components have a perovskite structure that contains silver in A-positions and niobium and tantalum in B-positions. A composition of a first component and a composition of a second component are such that temperature coefficients of respective permittivities TkεA and TkεB have different signs within a temperature range.

摘要翻译： 电容器包括至少两对相对的电极层和中间介电层。 中间介电层包括含有分离相中存在的至少两种不同组分的陶瓷材料。 所述至少两种不同的组分具有钙钛矿结构，其在A位中含有银，在B位含有铌和钽。 第一组分和第二组分的组合物的组成使得各个介电常数T kepsilon A和Tkepsilon B的温度系数在温度范围内具有不同的符号。