Invention Application
- Patent Title: Process for producing an integrated electronic circuit comprising superposed components and integrated electronic circuit thus obtained
- Patent Title (中): 一种集成电子电路的制造方法，包括由此获得的重叠部件和集成电子电路
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Application No.: US10850040Application Date: 2004-05-20
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Publication No.: US20050037593A1Publication Date: 2005-02-17
- Inventor: Philippe Delpech , Christophe Regnier , Sebastien Cremer , Stephane Monfray
- Applicant: Philippe Delpech , Christophe Regnier , Sebastien Cremer , Stephane Monfray
- Applicant Address: FR MONTROUGE
- Assignee: STMICROELECTRONICS SA
- Current Assignee: STMICROELECTRONICS SA
- Current Assignee Address: FR MONTROUGE
- Priority: FR0306030 20030520
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/336 ; H01L21/762 ; H01L29/786 ; H01L21/76
Abstract:
A process for producing an integrated electronic circuit comprises the production of a first electronic component and a second electronic component that are superposed on top of a substrate. A volume of temporary material is formed on the substrate at the position of the second electronic component. The first electronic component is then produced above the volume of temporary material relative to the substrate, and then the second electronic component is produced using at least one shaft for access to the temporary material. The first electronic component may be an active component and the second electronic component may be a passive component.
Public/Granted literature
Information query
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