发明申请
- 专利标题： Chip carrier for semiconductor chip
- 专利标题（中）： 半导体芯片芯片载体
-
申请号： US10909029申请日： 2004-07-30
-
公开(公告)号： US20050040524A1公开(公告)日： 2005-02-24
- 发明人: Han-Ping Pu , Chang-Fu Lin , Chien-Ping Huang
- 申请人： Han-Ping Pu , Chang-Fu Lin , Chien-Ping Huang
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 优先权： TW092122583 20030818
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/48
摘要：
A chip carrier for a semiconductor chip is provided. A plurality of solder pads for bump soldering are formed on a chip mounting surface of the chip carrier, to allow a flip chip to be mounted and electrically connected to the chip carrier. A solder mask layer is formed on the chip carrier, wherein a plurality of openings are provided in the solder mask layer to expose the solder pads, and an outwardly opening extended portion is formed respectively from the openings corresponding to the solder pads having a relatively narrower pitch therebetween, so as to prevent formation of voids during an underfill process for filing a gap between the flip chip and the chip carrier.
公开/授权文献
- US07102239B2 Chip carrier for semiconductor chip 公开/授权日：2006-09-05
信息查询
IPC分类:
