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31 条记录 (耗时 0.025 秒)

    Chip carrier for semiconductor chip
    2.
    发明申请
    Chip carrier for semiconductor chip 有权
    半导体芯片芯片载体

    公开(公告)号：US20050040524A1

    公开(公告)日：2005-02-24

    申请号：US10909029

    申请日：2004-07-30

    申请人： Han-Ping Pu ,  Chang-Fu Lin ,  Chien-Ping Huang

    发明人： Han-Ping Pu ,  Chang-Fu Lin ,  Chien-Ping Huang

    IPC分类号： H01L23/498 ,  H01L23/48

    CPC分类号： H01L23/49816 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15311

    摘要： A chip carrier for a semiconductor chip is provided. A plurality of solder pads for bump soldering are formed on a chip mounting surface of the chip carrier, to allow a flip chip to be mounted and electrically connected to the chip carrier. A solder mask layer is formed on the chip carrier, wherein a plurality of openings are provided in the solder mask layer to expose the solder pads, and an outwardly opening extended portion is formed respectively from the openings corresponding to the solder pads having a relatively narrower pitch therebetween, so as to prevent formation of voids during an underfill process for filing a gap between the flip chip and the chip carrier.

    摘要翻译： 提供了一种用于半导体芯片的芯片载体。 在芯片载体的芯片安装表面上形成用于凸块焊接的多个焊盘，以允许倒装芯片安装并电连接到芯片载体。 在芯片载体上形成焊料掩模层，其中在焊料掩模层中设置多个开口以露出焊盘，并且从对应于具有相对较窄的焊盘的开口分别形成向外开口的延伸部分 间隔，以防止在底部填充过程中形成空隙，以便在倒装芯片和芯片载体之间填充间隙。

    Semiconductor package with heat sink
    4.
    发明授权
    Semiconductor package with heat sink 有权
    半导体封装带散热片

    公开(公告)号：US07057276B2

    公开(公告)日：2006-06-06

    申请号：US10690921

    申请日：2003-10-21

    申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Chien-Ping Huang

    发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Chien-Ping Huang

    IPC分类号： H01L23/10 ,  H01L23/34

    CPC分类号： H01L23/367 ,  H01L23/3672 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2224/05599

    摘要： A semiconductor package with a heat sink is provided. At least one chip and a heat sink attached to the chip are mounted on a substrate. At least one slot is formed through at least one corner of the heat sink at a position attached to the substrate. An adhesive material is applied between the heat sink and substrate and over filled in the slot with an overflow of the adhesive material out of the slot. The adhesive material over filled in the slot provides an anchoring effect and increases its contact area with the heat sink to thereby firmly secure the heat sink on the substrate. Further, the slot formed at the corner of the heat sink can alleviate thermal stresses accumulated at the corner of the heat sink and thereby prevent delamination between the heat sink and the substrate.

    摘要翻译： 提供了具有散热器的半导体封装。 连接到芯片的至少一个芯片和散热片安装在基板上。 在连接到基板的位置处，通过散热器的至少一个角部形成至少一个槽。 将粘合剂材料施加在散热器和衬底之间并且在填充在槽中并且粘合剂材料溢出出槽之外。 填充在槽中的粘合剂材料提供锚定效果并增加其与散热器的接触面积，从而将散热器牢固地固定在基板上。 此外，形成在散热器角落处的槽可以减轻积聚在散热器拐角处的热应力，从而防止散热器和基板之间的分层。

    Semiconductor package with heat sink
    7.
    发明授权
    Semiconductor package with heat sink 有权
    半导体封装带散热片

    公开(公告)号：US07177155B2

    公开(公告)日：2007-02-13

    申请号：US11212290

    申请日：2005-08-26

    申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

    发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

    IPC分类号： H05K7/20 ,  H01L23/34

    CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/00014

    摘要： A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

    摘要翻译： 提供了具有散热器的半导体封装，其中至少一个芯片安装在基板上并被散热器覆盖。 散热器在与基板接触的位置处形成有多个凹槽或孔，允许将粘合材料施加在散热器和基板之间并填充到用于将散热器附接到基板上的凹槽或孔中。 填充到槽或孔中的粘合剂材料提供了将散热器牢固地定位在基板上的锚固效果。 因此，不需要在基板上形成预定的孔，用于连接诸如螺栓的固定构件，并且散热器的结合不会影响迹线布线性以及衬底上的诸如焊球的输入/输出连接的布置 不会导致芯片的裂纹。

    Chip carrier for semiconductor chip
    8.
    发明授权
    Chip carrier for semiconductor chip 有权
    半导体芯片芯片载体

    公开(公告)号：US07102239B2

    公开(公告)日：2006-09-05

    申请号：US10909029

    申请日：2004-07-30

    申请人： Han-Ping Pu ,  Chang-Fu Lin ,  Chien-Ping Huang

    发明人： Han-Ping Pu ,  Chang-Fu Lin ,  Chien-Ping Huang

    IPC分类号： H01L23/48

    CPC分类号： H01L23/49816 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15311

    摘要： A chip carrier for a semiconductor chip is provided. A plurality of solder pads for bump soldering are formed on a chip mounting surface of the chip carrier, to allow a flip chip to be mounted and electrically connected to the chip carrier. A solder mask layer is formed on the chip carrier, wherein a plurality of openings are provided in the solder mask layer to expose the solder pads, and an outwardly opening extended portion is formed respectively from the openings corresponding to the solder pads having a relatively narrower pitch therebetween, so as to prevent formation of voids during an underfill process for filing a gap between the flip chip and the chip carrier.

    摘要翻译： 提供了一种用于半导体芯片的芯片载体。 在芯片载体的芯片安装表面上形成用于凸块焊接的多个焊盘，以允许倒装芯片安装并电连接到芯片载体。 在芯片载体上形成焊料掩模层，其中在焊料掩模层中设置多个开口以露出焊盘，并且从对应于具有相对较窄的焊盘的开口分别形成向外开口的延伸部分 间隔，以防止在底部填充过程中形成空隙，以便在倒装芯片和芯片载体之间填充间隙。

    Semiconductor package with heat sink
    9.
    发明申请
    Semiconductor package with heat sink 有权
    半导体封装带散热片

    公开(公告)号：US20060017145A1

    公开(公告)日：2006-01-26

    申请号：US11212182

    申请日：2005-08-26

    申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Huang

    发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Huang

    IPC分类号： H01L23/06

    CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/00014

    摘要： A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

    摘要翻译： 提供了具有散热器的半导体封装，其中至少一个芯片安装在基板上并被散热器覆盖。 散热器在与基板接触的位置处形成有多个凹槽或孔，允许将粘合材料施加在散热器和基板之间并填充到用于将散热器附接到基板上的凹槽或孔中。 填充到槽或孔中的粘合剂材料提供了将散热器牢固地定位在基板上的锚固效果。 因此，不需要在基板上形成预定的孔，用于连接诸如螺栓的固定构件，并且散热器的结合不会影响迹线布线性以及诸如衬底上的焊球等输入/输出连接的布置 不会导致芯片的裂纹。

    Semiconductor package with heat sink
    10.
    发明申请
    Semiconductor package with heat sink 有权
    半导体封装带散热片

    公开(公告)号：US20050280132A1

    公开(公告)日：2005-12-22

    申请号：US11212290

    申请日：2005-08-26

    申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Huang

    发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Huang

    IPC分类号： H01L23/367 ,  H01L23/06

    CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/00014

    摘要： A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

    摘要翻译： 提供了具有散热器的半导体封装，其中至少一个芯片安装在基板上并被散热器覆盖。 散热器在与基板接触的位置处形成有多个凹槽或孔，允许将粘合材料施加在散热器和基板之间并填充到用于将散热器附接到基板上的凹槽或孔中。 填充到槽或孔中的粘合剂材料提供了将散热器牢固地定位在基板上的锚固效果。 因此，不需要在基板上形成预定的孔，用于连接诸如螺栓的固定构件，并且散热器的结合不会影响迹线布线性以及诸如衬底上的焊球等输入/输出连接的布置 不会导致芯片的裂纹。