发明申请
- 专利标题： Process modules for transport polymerization of low epsilon thin films
- 专利标题（中）： 低ε薄膜的运输聚合工艺模块
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申请号： US10820447申请日： 2004-04-07
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公开(公告)号： US20050047927A1公开(公告)日： 2005-03-03
- 发明人: Chung Lee , Oanh Nguyen , Wei Lee , Michael Solomensky , Atul Kumar , James Chung Chang , Binh Nguyen
- 申请人： Chung Lee , Oanh Nguyen , Wei Lee , Michael Solomensky , Atul Kumar , James Chung Chang , Binh Nguyen
- 主分类号： B05D1/00
- IPC分类号： B05D1/00 ; B05D3/06 ; B05D7/24 ; C23C16/452 ; H01L21/312 ; F04B1/00
摘要：
A Process Module (“PM”) is designed to facilitate Transport Polymerization (“TP”) of precursors that are useful for preparations of low Dielectric Constant (“∈”) films. The PM consists primarily of a Material Delivery System (“MDS”) with a high temperature Vapor Phase Controller (“VFC”), a TP Reactor, a Treatment Chamber, a Deposition Chamber and a Pumping System. The PM is designed to facilitate TP for new precursors and for film deposition and stabilization processes.
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