发明申请
- 专利标题： Circuit-component-containing module
- 专利标题（中）： 电路元件模块
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申请号： US10499036申请日： 2003-09-04
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公开(公告)号： US20050051358A1公开(公告)日： 2005-03-10
- 发明人: Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
- 申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
- 优先权： JP2002-266736 20020912
- 国际申请： PCT/JP03/11296 WO 20030904
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/14 ; H05K3/28 ; H05K3/34 ; H05K3/46 ; H05K9/00 ; H05K7/06
摘要：
A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
公开/授权文献
- US07382628B2 Circuit-component-containing module 公开/授权日：2008-06-03
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