A method of defect management, comprising performing tool matching inspection within a defect management system and at least including scanning a produced wafer; checking a user level within the defect management system and the defect management system distributes resources of the defect management system according to the user level. An analyzing procedure template is edited and the defect management system executes an analyzing procedure according to the analyzing procedure template. Defect data is pre-filtered according to at least one basis and the basis is selected from the group of following terms: unclassified/classified, defect class, defect size, image type, defect pattern, and combining with CP data. A result report is output, wherein the result report combines the analysis procedure template with defect data.