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发明申请
US20050061661A1 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive 审中-公开
用于已经导电的涂层结构的电沉积装置和电沉积系统

Electrodeposition device and electrodeposition system for coating structures which have already been made conductive
摘要：
Electrodeposition device for electrodepositing an electrically conductive layer on a substrate having an electrolyte bath in which an anode device and at least one contact-making unit are arranged, each contact-making unit having a plurality of electrically conductive regions of which at least one is connected cathodically and at least one is connected anodically.
摘要（中）：

电沉积装置，用于在具有阳极装置和至少一个接触制造单元的电解质浴的基底上电沉积导电层，每个接触制备单元具有至少一个连接的多个导电区域 阴极和至少一个阳极连接。

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