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公开(公告)号：US20070082127A1
公开(公告)日：2007-04-12
申请号：US11608663
申请日：2006-12-08
Applicant: Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
Inventor： Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
CPC classification number: H05K3/046 , H05K3/102 , Y10T428/24917
Abstract: Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.
Abstract translation: 或者在基板主体上制造结构化金属层的方法，其中将结构化接合层施加到基板主体上，以将金属箔或金属粉末固定在该接合层上，或者其中金属箔 或者将金属层施加到由塑料材料制成的基板主体的整个表面上，并借助于结构化的加热冲头将其压在基板主体上，并通过基板主体的后续设置来固定。 金属层是通过机械去除金属箔或金属粉末的那些区域而构成的，这些区域不与粘合剂或基底本体接合。
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2.发明授权Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam 失效用于制造泡沫金属结构的方法，金属泡沫和具有载体基底和金属泡沫的布置公开(公告)号：US07192509B2
公开(公告)日：2007-03-20
申请号：US11062318
申请日：2005-02-18
Applicant: Andreas Karl , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
Inventor： Andreas Karl , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
CPC classification number: C23C18/2086 , C23C18/1644 , C23C18/1653 , C25D5/56 , Y10T428/12063
Abstract: Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.
Abstract translation: 制造泡沫金属结构的方法，包括以下步骤：提供具有发泡结构的非导电基材，将导电颗粒施加到基材上，使得导电颗粒固定在基材的整个表面上，特别是固定在每个 将该预处理基板导入电镀装置，在该电镀装置中，在导电性粒子上形成均匀的金属层。
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3.发明申请Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam 失效用于制造泡沫金属结构的方法，金属泡沫和具有载体基底和金属泡沫的布置公开(公告)号：US20050194259A1
公开(公告)日：2005-09-08
申请号：US11062318
申请日：2005-02-18
Applicant: Andreas Karl , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
Inventor： Andreas Karl , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
CPC classification number: C23C18/2086 , C23C18/1644 , C23C18/1653 , C25D5/56 , Y10T428/12063
Abstract: Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.
Abstract translation: 制造泡沫金属结构的方法，包括以下步骤：提供具有发泡结构的非导电基材，将导电颗粒施加到基材上，使得导电颗粒固定在基材的整个表面上，特别是固定在每个 将该预处理基板导入电镀装置，在该电镀装置中，在导电性粒子上形成均匀的金属层。
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公开(公告)号：US20060246628A1
公开(公告)日：2006-11-02
申请号：US11392451
申请日：2006-03-29
Applicant: Frank Puschner , Wolfgang Schindler , Ewald Simmerlein-Erlbacher , Peter Stampka
Inventor： Frank Puschner , Wolfgang Schindler , Ewald Simmerlein-Erlbacher , Peter Stampka
IPC: H01L21/00 , H01L23/10 , H01L23/043
CPC classification number: G06K19/07747 , G06K19/07743 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
Abstract: A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.
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5.发明申请Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer 审中-公开在基体上制造结构化金属层的方法，以及具有结构化金属层的基体公开(公告)号：US20050034995A1
公开(公告)日：2005-02-17
申请号：US10917554
申请日：2004-08-12
Applicant: Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
Inventor： Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
CPC classification number: H05K3/046 , H05K3/102 , Y10T428/24917
Abstract: Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.
Abstract translation: 或者在基板主体上制造结构化金属层的方法，其中将结构化接合层施加到基板主体上，以将金属箔或金属粉末固定在该接合层上，或者其中金属箔 或者将金属层施加到由塑料材料制成的基板主体的整个表面上，并借助于结构化的加热冲头将其压在基板主体上，并通过基板主体的后续设置来固定。 金属层是通过机械去除金属箔或金属粉末的那些区域而构成的，这些区域不与粘合剂或基底本体接合。
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Patent Agency Ranking
6.发明授权公开(公告)号：US07579679B2
公开(公告)日：2009-08-25
申请号：US11392451
申请日：2006-03-29
Applicant: Frank Püschner , Wolfgang Schindler , Ewald Simmerlein-Erlbacher , Peter Stampka
Inventor： Frank Püschner , Wolfgang Schindler , Ewald Simmerlein-Erlbacher , Peter Stampka
IPC: H01L23/02
CPC classification number: G06K19/07747 , G06K19/07743 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
Abstract: A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.
Abstract translation: 具有集成电路并且用于外部接触的芯片模块的芯片卡在主表面上具有彼此间隔开并且与集成电路电连接的多个接触区域的接触区域。 至少一个接触区域由具有第一表面的第一功能区域和具有第二表面的第二功能区域构成，并且第一功能区域的第一表面相对于主面高于第二功能区域的第二表面 。
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7.发明申请Electrodeposition device and electrodeposition system for coating structures which have already been made conductive 审中-公开用于已经导电的涂层结构的电沉积装置和电沉积系统公开(公告)号：US20050061661A1
公开(公告)日：2005-03-24
申请号：US10916308
申请日：2004-08-11
Applicant: Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher , Andreas Karl
Inventor： Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher , Andreas Karl
CPC classification number: C25D5/18 , C25D7/0614 , C25D7/0657 , H05K1/0393 , H05K3/241
Abstract: Electrodeposition device for electrodepositing an electrically conductive layer on a substrate having an electrolyte bath in which an anode device and at least one contact-making unit are arranged, each contact-making unit having a plurality of electrically conductive regions of which at least one is connected cathodically and at least one is connected anodically.
Abstract translation: 电沉积装置，用于在具有阳极装置和至少一个接触制造单元的电解质浴的基底上电沉积导电层，每个接触制备单元具有至少一个连接的多个导电区域 阴极和至少一个阳极连接。
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8.发明申请Process for producing a metal layer on a substrate body, and substrate body having a metal layer 失效在基体上制造金属层的方法，以及具有金属层的基体公开(公告)号：US20050052326A1
公开(公告)日：2005-03-10
申请号：US10916321
申请日：2004-08-11
Applicant: Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
Inventor： Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
CPC classification number: H05K3/246 , C23C2/02 , C23C18/1817 , C23C18/1841 , C23C18/1865 , C23C18/1889 , C23C18/2033 , C23C18/208 , C23C18/31 , C25D5/54 , C25D5/56 , H05K3/102 , H05K3/386 , Y10T428/24355 , Y10T428/24893 , Y10T428/24917 , Y10T428/25
Abstract: Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.
Abstract translation: 在基体上制造金属层的方法。 该方法包括将导电颗粒施加到衬底主体的表面上，使得导电颗粒固定到衬底主体，并且通过化学和/或电沉积在金属化浴中将衬底主体与颗粒一起金属化以形成 金属层。
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公开(公告)号：US20070099020A1
公开(公告)日：2007-05-03
申请号：US11566856
申请日：2006-12-05
Applicant: ANDREAS KARL , Andreas Muller- Hipper , Ewald Simmerlein- Erlbacher
Inventor： ANDREAS KARL , Andreas Muller- Hipper , Ewald Simmerlein- Erlbacher
IPC: B32B15/02
CPC classification number: C23C18/2086 , C23C18/1644 , C23C18/1653 , C25D5/56 , Y10T428/12063
Abstract: A metal foam having a nonconductive substrate with a foamed structure which includes pores, the surface of the substrate being provided with conductive particles, and a homogenous metal layer being arranged on the conductive particles.
Abstract translation: 一种具有发泡结构的非导电基底的金属泡沫体，其包括孔，所述基底的表面设有导电颗粒，并且均匀的金属层被布置在导电颗粒上。
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10.发明授权Process for producing a metal layer on a substrate body, and substrate body having a metal layer 失效在基体上制造金属层的方法，以及具有金属层的基体公开(公告)号：US06984446B2
公开(公告)日：2006-01-10
申请号：US10916321
申请日：2004-08-11
Applicant: Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
Inventor： Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
CPC classification number: H05K3/246 , C23C2/02 , C23C18/1817 , C23C18/1841 , C23C18/1865 , C23C18/1889 , C23C18/2033 , C23C18/208 , C23C18/31 , C25D5/54 , C25D5/56 , H05K3/102 , H05K3/386 , Y10T428/24355 , Y10T428/24893 , Y10T428/24917 , Y10T428/25
Abstract: Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.
Abstract translation: 在基体上制造金属层的方法。 该方法包括将导电颗粒施加到衬底主体的表面上，使得导电颗粒固定到衬底主体，并且通过化学和/或电沉积在金属化浴中将衬底主体与颗粒一起金属化以形成 金属层。
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