- 专利标题： Wafer-level packaging of optoelectronic devices
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申请号： US10666363申请日： 2003-09-19
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公开(公告)号： US20050062122A1公开(公告)日： 2005-03-24
- 发明人: Kendra Gallup , Frank Geefay , Ronald Fazzio , Martha Johnson , Carrie Guthrie , Tanya Snyder , Richard Ruby
- 申请人： Kendra Gallup , Frank Geefay , Ronald Fazzio , Martha Johnson , Carrie Guthrie , Tanya Snyder , Richard Ruby
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; B81B7/00 ; B81C3/00 ; G02B6/42 ; H01L21/00 ; H01L21/46 ; H01L21/60 ; H01L23/495 ; H01L31/0203 ; H01L31/0232 ; H01L33/00 ; H01S5/00 ; H01S5/02 ; H01S5/022 ; H01S5/026
摘要：
A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.
公开/授权文献
- US06953990B2 Wafer-level packaging of optoelectronic devices 公开/授权日：2005-10-11
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