发明申请
- 专利标题： Semiconductor device having heat dissipation layer
- 专利标题（中）： 具有散热层的半导体器件
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申请号： US10940232申请日： 2004-09-13
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公开(公告)号： US20050062147A1公开(公告)日： 2005-03-24
- 发明人: Shinji Wakisaka , Hiroyasu Jobetto
- 申请人： Shinji Wakisaka , Hiroyasu Jobetto
- 申请人地址： JP Tokyo
- 专利权人： Casio Computer Co., Ltd.
- 当前专利权人： Casio Computer Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2003-328911 20030919
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/3205 ; H01L21/768 ; H01L23/12 ; H01L23/31 ; H01L23/34 ; H01L23/367 ; H01L23/498 ; H05K1/00
摘要：
A semiconductor device includes a semiconductor constructing body which has a semiconductor substrate, a plurality of external connection electrodes formed on the semiconductor substrate, and heat dissipation columnar electrodes. Upper interconnections are mounted on one side of the semiconductor constructing body and connected to the external connection electrodes of the semiconductor constructing body. A heat dissipation layer is mounted on one side of the semiconductor constructing body and made of the same material as that of the upper interconnections.
公开/授权文献
- US07042081B2 Semiconductor device having heat dissipation layer 公开/授权日：2006-05-09
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