发明申请
- 专利标题： Integrated lead suspension and method of construction
- 专利标题（中）： 综合铅悬浮和施工方法
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申请号： US10963704申请日： 2004-10-13
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公开(公告)号： US20050063096A1公开(公告)日： 2005-03-24
- 发明人: Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
- 申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
- 优先权： JP2001-313491 20011011
- 主分类号： G11B5/60
- IPC分类号： G11B5/60 ; G11B5/48 ; G11B21/21 ; H05K1/18 ; H05K3/34 ; G11B21/22 ; G11B5/54
摘要：
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
公开/授权文献
- US06989969B2 Integrated lead suspension and method of construction 公开/授权日：2006-01-24
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