摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.
摘要:
A method and an apparatus for liquid supply use a pressure tank and a plurality of pumps. When the pressure or liquid quantity in the pressure tank has decreased below a predetermined level, a preceding or regular pump starts. When the demand is too large for this pump, another pump in standby position starts, too. The regular pump continues running for a predetermined period of time after the start, even if the pressure or liquid quantity in the pressure tank has returned to a predetermined level, whereas the standby comes to a stop upon such recovery. In this manner the frequency of starting the pumps is minimized so as to avoid overheating of pump-driving motors and reduce the power consumption.
摘要:
Embodiments of the invention relate to techniques to remove a defective head gimbal assembly (HGA) from a head stack assembly and replace the defective HGA with a good one without allowing any good HGAs to be damaged. In one embodiment, a volatile alcohol solvent is moved by gravity from a holder included in a reworking tool provided for a reworking jig to a shearing edge of a cartridge type edge mounted in the holder. The alcohol solvent is thereby deposited on the shearing edge in a drop-like shape through surface tension. The cartridge type edge is made to slide on a surface of an actuator arm and is inserted in a gap between contacting surfaces of a mount plate and the actuator arm. This assigns the drop-like alcohol solvent a function as a lubricant. Possible vibration can therefore be prevented from being transmitted through a carriage to other HGAs.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
Embodiments of the invention relate to techniques to remove a defective head gimbal assembly (HGA) from a head stack assembly and replace the defective HGA with a good one without allowing any good HGAs to be damaged. In one embodiment, a volatile alcohol solvent is moved by gravity from a holder included in a reworking tool provided for a reworking jig to a shearing edge of a cartridge type edge mounted in the holder. The alcohol solvent is thereby deposited on the shearing edge in a drop-like shape through surface tension. The cartridge type edge is, in this condition, made to slide on a surface of an actuator arm and is thereby inserted in a gap between contacting surfaces of a base plate of a mount plate and the actuator arm. This assigns the drop-like alcohol solvent a function as a lubricant. Possible vibration can therefore be prevented from being transmitted through a carriage to other HGAs.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.