Invention Application
- Patent Title: Thermosetting laminating resin composition
- Patent Title (中): 热固性层压树脂组合物
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Application No.: US10946599Application Date: 2004-09-21
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Publication No.: US20050064216A1Publication Date: 2005-03-24
- Inventor: Lixin Jin , Hildeberto Nava
- Applicant: Lixin Jin , Hildeberto Nava
- Main IPC: B32B27/08
- IPC: B32B27/08 ; C08G18/67 ; C08K3/00 ; C08K5/00 ; C08L67/06 ; C08L75/16 ; B32B27/36 ; C08L67/00

Abstract:
The present invention provides a thermosetting resin composition based on an orthophthalic unsaturated polymer resin, a dicyclopentadiene (DCPD) resin and a polyether urethane acrylate having two or more acrylate functionality per molecule.
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