发明申请
- 专利标题: Polymerizable composition and cured resin composition
- 专利标题(中): 可聚合组合物和固化树脂组合物
-
申请号: US10504170申请日: 2003-02-17
-
公开(公告)号: US20050065255A1公开(公告)日: 2005-03-24
- 发明人: Takeharu Morita , Nobuhiro Goto , Hiroshi Yoshitani , Hiroshi Hiraike
- 申请人: Takeharu Morita , Nobuhiro Goto , Hiroshi Yoshitani , Hiroshi Hiraike
- 专利权人: Sekisui Chemical Co.,Ltd.
- 当前专利权人: Sekisui Chemical Co.,Ltd.
- 优先权: JP2002-039202 20020215
- 国际申请: PCT/JP03/01623 WO 20030217
- 主分类号: C08G61/08
- IPC分类号: C08G61/08 ; C08L65/00 ; H05K1/03 ; C08L1/00
摘要:
It is an object of the present invention to provide a polymerizable composition and a cured resin composition, linear expansion coefficients of which are significantly improved without impairment of the excellent properties such as heat resistance, mechanical strength and the like of norbornene-based resins. The present invention is a polymerizable composition, which comprises a polymerizable substance containing a norbornene-based monomer or oligomer as a main component, a metathesis polymerization catalyst and silica powder, the weight content of the silica powder being larger than the weight content of the polymerizable substance.
公开/授权文献
- US06977284B2 Polymerizable composition and cured resin composition 公开/授权日:2005-12-20
信息查询