Invention Application
US20050067378A1 Method for micro-roughening treatment of copper and mixed-metal circuitry
审中-公开
铜和混合金属电路的微粗化处理方法
- Patent Title: Method for micro-roughening treatment of copper and mixed-metal circuitry
- Patent Title (中): 铜和混合金属电路的微粗化处理方法
-
Application No.: US10675019Application Date: 2003-09-30
-
Publication No.: US20050067378A1Publication Date: 2005-03-31
- Inventor: Harry Fuerhaupter , David Baron , Kuldip Johal , Patrick Brooks
- Applicant: Harry Fuerhaupter , David Baron , Kuldip Johal , Patrick Brooks
- Main IPC: C23F1/18
- IPC: C23F1/18 ; H05K3/02 ; H05K3/06 ; H05K3/38 ; H05K3/46 ; B44C1/22
Abstract:
Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
Information query
IPC分类:
