发明申请
US20050068757A1 Stress compensation layer systems for improved second level solder joint reliability
审中-公开
应力补偿层系统可提高二级焊点的可靠性
- 专利标题： Stress compensation layer systems for improved second level solder joint reliability
- 专利标题（中）： 应力补偿层系统可提高二级焊点的可靠性
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申请号： US10676548申请日： 2003-09-30
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公开(公告)号： US20050068757A1公开(公告)日： 2005-03-31
- 发明人: Saikumar Jayaraman , Terry Sterrett , Connie Gettinger , Vijay Wakharkar , Agnes Padovani
- 申请人： Saikumar Jayaraman , Terry Sterrett , Connie Gettinger , Vijay Wakharkar , Agnes Padovani
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H05K1/02 ; H05K3/34 ; H05K1/11 ; H05K1/14
摘要：
According to one aspect of the present invention, an electronic assembly and a method of forming an electronic assembly are provided. A semiconductor package includes a package substrate with a microelectronic die mounted to a first side and contact formations attached to a second side thereof. A stress compensation layer is formed on the first surface between the contact formations. The semiconductor package is then attached to a circuit board leaving an air space between the stress compensation layer and the circuit board. The stress compensation layer reduces stress on the contact formations and increases solder joint reliability.
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