发明申请
- 专利标题： Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
- 专利标题（中）： 在晶片衬底上沉积，释放和封装微机电器件的方法
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申请号： US10167361申请日： 2002-06-11
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公开(公告)号： US20050074919A1公开(公告)日： 2005-04-07
- 发明人: Satayadev Patel , Andrew Huibers , Steve Chiang , Robert Duboc , Thomas Grobelny , Hung Chen , Dietrich Dehlinger , Peter Richards , Hongqin Shi , Anthony Sun
- 申请人： Satayadev Patel , Andrew Huibers , Steve Chiang , Robert Duboc , Thomas Grobelny , Hung Chen , Dietrich Dehlinger , Peter Richards , Hongqin Shi , Anthony Sun
- 申请人地址： US CA Santa Clara
- 专利权人： REFLECTIVITY, INC.
- 当前专利权人： REFLECTIVITY, INC.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： B81B3/00
- IPC分类号： B81B3/00 ; B81B7/00 ; B81C1/00 ; B81C3/00 ; B81C99/00 ; G02B26/08 ; H01L21/301 ; H01L21/60 ; H01L23/02 ; H01L23/22 ; H01L23/24 ; H01L21/44
摘要：
A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.
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