Invention Application
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US10760503Application Date: 2004-01-21
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Publication No.: US20050077631A1Publication Date: 2005-04-14
- Inventor: Taketo Fukuro
- Applicant: Taketo Fukuro
- Priority: JP2003-352212 20031010
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/329 ; H01L29/417 ; H01L29/861 ; H01L29/06 ; H01L31/0352

Abstract:
Leakage current generated in a PN junction diode is reduced, and charge-up current caused by plasma treatment in formation of wiring connected to the PN junction diode is controlled. An N+ region as a first conductive type impurity region provided in a Si substrate with an upper surface being exposed on one main surface of the Si substrate, a P+ polysilicon plug provided with a bottom being contacted with an upper surface of the N+ region, and wiring connected to a top of the P+ polysilicon plug are included.
Public/Granted literature
- US07309921B2 Semiconductor device Public/Granted day:2007-12-18
Information query
IPC分类: