Pb-free solder alloy, and solder material and solder joint using same

Invention Application

US20050079092A1 Pb-free solder alloy, and solder material and solder joint using same 审中-公开

Title translation: 无铅焊料合金，焊料和焊点使用相同

Patent Title: Pb-free solder alloy, and solder material and solder joint using same
Patent Title (中): 无铅焊料合金，焊料和焊点使用相同
Application No.: US10960116

Application Date: 2004-10-08
Publication No.: US20050079092A1

Publication Date: 2005-04-14
Inventor: Shinya Ochi , Fumitoshi Tawara
Applicant: Shinya Ochi , Fumitoshi Tawara
Applicant Address: JP Osaka
Assignee: Matsushita Electric Industrial Co., Ltd.
Current Assignee: Matsushita Electric Industrial Co., Ltd.
Current Assignee Address: JP Osaka
Priority: JP2003-352015 20031010; JP2004-223189 20040730
Main IPC: B23K35/22
IPC: B23K35/22 ; B23K35/26 ; C22C13/00

Abstract:

A solder alloy based on an Sn—Zn—In—Ag system contains, in weight, 3.0%

Abstract(Chinese):

基于Sn-Zn-In-Ag系的焊料合金的重量含有3.0％

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Global Dossier Espacenet

IPC分类:

B	作业；运输
B23	机床；其他类目中不包括的金属加工
B23K	钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工（用金属的挤压来制造金属包覆产品入B21C23/22；用铸造方法制造衬套或包覆层入B22D19/08；用浸入方式的铸造入B22D23/04；用烧结金属粉末制造复合层入B22F7/00；机床上的仿形加工或控制装置入B23Q；不包含在其他类目中的包覆金属或金属包覆材料入C23C；燃烧器入F23D）
B23K35/00	用于钎焊、焊接或切割的焊条、电极、材料或介质
B23K35/22	.以材料的成分和性质为特征的