Invention Application
- Patent Title: Multi-surface IC packaging structures and methods for their manufacture
- Patent Title (中): 多表面IC封装结构及其制造方法
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Application No.: US10947686Application Date: 2004-09-23
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Publication No.: US20050093127A1Publication Date: 2005-05-05
- Inventor: Joseph Fjelstad , Para Segaram , Thomas Obenhuber , Inessa Obenhuber , Kevin Grundy
- Applicant: Joseph Fjelstad , Para Segaram , Thomas Obenhuber , Inessa Obenhuber , Kevin Grundy
- Main IPC: H01L
- IPC: H01L20060101 ; H01L21/56 ; H01L23/31 ; H01L23/48 ; H01L23/495 ; H01L23/498
Abstract:
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
Public/Granted literature
- US07061096B2 Multi-surface IC packaging structures and methods for their manufacture Public/Granted day:2006-06-13
Information query
