Invention Application
- Patent Title: Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
- Patent Title (中): 用于拾取半导体芯片的方法和装置，用于从切割带去除半导体芯片的方法和装置，以及形成穿孔切割带
-
Application No.: US10981468Application Date: 2004-11-05
-
Publication No.: US20050095100A1Publication Date: 2005-05-05
- Inventor: Cheol-Joon Yoo
- Applicant: Cheol-Joon Yoo
- Priority: KR2002-69666 20021111
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/00 ; H01L21/68 ; B65B21/02 ; B65B69/00 ; B65G65/04 ; B65G65/34
Abstract:
A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.
Public/Granted literature
Information query
IPC分类:
