Invention Application
- Patent Title: Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
- Patent Title (中): 将铜电化学沉积到工件阻挡层上的方法
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Application No.: US10705579Application Date: 2003-11-10
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Publication No.: US20050098440A1Publication Date: 2005-05-12
- Inventor: Sridhar Kailasam , John Drewery , Jonathan Reid , Eric Webb , Johanes Sukamto
- Applicant: Sridhar Kailasam , John Drewery , Jonathan Reid , Eric Webb , Johanes Sukamto
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D5/02 ; C25D7/12 ; H01L21/288 ; H01L21/768
Abstract:
Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.
Public/Granted literature
- US07341946B2 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Public/Granted day:2008-03-11
Information query
