公开(公告)号：US20050098440A1

公开(公告)日：2005-05-12

申请号：US10705579

申请日：2003-11-10

申请人： Sridhar Kailasam ,  John Drewery ,  Jonathan Reid ,  Eric Webb ,  Johanes Sukamto

发明人： Sridhar Kailasam ,  John Drewery ,  Jonathan Reid ,  Eric Webb ,  Johanes Sukamto

IPC分类号： C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/768

CPC分类号： H01L21/76843 ,  C25D7/12 ,  H01L21/2885 ,  H01L21/76856 ,  H01L21/76873 ,  H01L21/76877

摘要： Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.

摘要翻译： 提供了用于在工件上电化学沉积铜的方法。 一种方法包括沉积覆盖工件的具有表面的阻挡层并使阻挡层表面经受适于促进铜在阻挡层上沉积的表面处理的步骤。 然后将铜电化学沉积在覆盖阻挡层上。