发明申请
- 专利标题: High-frequency signal transmitting optical module and method of fabricating the same
- 专利标题(中): 高频信号发射光模块及其制造方法
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申请号: US10984748申请日: 2004-11-10
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公开(公告)号: US20050100293A1公开(公告)日: 2005-05-12
- 发明人: Yoshihisa Warashina , Yasuji Hoshino , Kei Tabata , Shogo Iyama
- 申请人: Yoshihisa Warashina , Yasuji Hoshino , Kei Tabata , Shogo Iyama
- 专利权人: HAMAMATSU PHOTONICS K.K.
- 当前专利权人: HAMAMATSU PHOTONICS K.K.
- 优先权: JPP2003-382540 20031112
- 主分类号: G02B6/36
- IPC分类号: G02B6/36 ; H01L31/0203 ; H01L31/032 ; H01L31/18 ; H01S5/022
摘要:
The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.
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