摘要:
An optical transmitting and receiving module, with which there is no need to provide a submount for disposing a photodiode on a substrate and with which spatial restrictions can be made small, is provided. An optical transmitting and receiving module 1 has a light transmitting substrate 10. A filter groove 13 is formed on a top surface of light transmitting substrate 10, and a dielectric multilayer film filter 23 is set in filter groove 13. An optical fiber 21 and a laser diode 25 are disposed at opposite positions across dielectric multilayer film filter 23. Also, a photodiode 26 is disposed on a rear surface side of light transmitting substrate 10. Photodiode 26 is positioned directly below a line connecting optical fiber 21 and laser diode 25.
摘要:
An optical transmitting and receiving module, with which there is no need to provide a submount for disposing a photodiode on a substrate and with which spatial restrictions can be made small, is provided. An optical transmitting and receiving module 1 has a light transmitting substrate 10. A filter groove 13 is formed on a top surface of light transmitting substrate 10, and a dielectric multilayer film filter 23 is set in filter groove 13. An optical fiber 21 and a laser diode 25 are disposed at opposite positions across dielectric multilayer film filter 23. Also, a photodiode 26 is disposed on a rear surface side of light transmitting substrate 10. Photodiode 26 is positioned directly below a line connecting optical fiber 21 and laser diode 25.
摘要:
The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.
摘要:
An optical module comprises: a sub-mount 1, having four photodiodes 12 and two guide grooves 10 disposed on an optical element mounting surface 16; a fiber fixing member 2, having four V-grooves 21, four concave mirrors 22, and two guide rails 20 disposed on an optical fiber fixing surface 26; and four optical fibers 3, fixed to the fiber fixing member 2. With this optical module, the sub-mount 1 and fiber fixing member 2 are aligned and fixed by the fitting together of the guide grooves 10 and guide rails 20. A passive alignment type optical module that enables mass production and cost reduction is thus realized.
摘要:
An optical module comprises: a sub-mount 1, having four photodiodes 12 and two guide grooves 10 disposed on an optical element mounting surface 16; a fiber fixing member 2, having four V-grooves 21, four concave mirrors 22, and two guide rails 20 disposed on an optical fiber fixing surface 26; and four optical fibers 3, fixed to the fiber fixing member 2. With this optical module, the sub-mount 1 and fiber fixing member 2 are aligned and fixed by the fitting together of the guide grooves 10 and guide rails 20. A passive alignment type optical module that enables mass production and cost reduction is thus realized.
摘要:
An optical wiring substrate that enables positioning of light emitting elements and photodetecting elements with respect to optical waveguides to be readily carried out is provided. An optical wiring substrate 1 has a substrate 10. On the substrate 10, a plurality of recessed portions 12 are formed and optical waveguides 13 are formed between these recessed portions 12. In each recessed portion 12 is disposed a photodetecting and light emitting member 30 that is mounted onto an inserted portion 22 of a base member 20. The inserted portion 22 has reflecting surfaces 26 and 27 formed on the inclined surfaces, and optical paths of optical waveguides 13 are matched, via reflecting surfaces 26 and 27, with optical paths of photodetecting units 34 and light emitting units 37, disposed on the photodetecting and light emitting member 30.
摘要:
An optical wiring board by which an optical waveguide can be easily aligned with a light emitting element and a light detecting element. The optical wiring board (1) is provided with a substrate (10). On the substrate (10), a plurality of recessed parts (12) are formed, and the optical waveguide (13) is formed between the recessed parts (12). In the recessed part (12), a light receiving/emitting member (30), which is mounted on an inserting part (22) on a base member (20), is arranged. In the inserting member (22), reflecting planes (26, 27) are formed on inclined planes, and an optical path of the optical waveguide (13) matches with that of a light detecting part (34) and a light emitting part (37) in the light receiving/emitting member (30) via the reflecting planes (26, 27).
摘要:
The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.
摘要:
In optical module 10, light emitted from laser diode (hereinafter referred to as “LD”) 42 is collimated into parallel light beam by ball lens 44 and then travels through ball lens 26 to be focused on core 104 of optical fiber 100. Since the light passing between ball lenses 44 and 26 is the parallel light beam as described above, allowance is enlarged for axial misalignment between the optical axes of ball lens 44 and ball lens 26. This enables the light from LD 42 to be focused on core 102 of optical fiber 100 even if there occurs axial misalignment between the optical axes of optical fiber 100 and LD 42 due to a factor resulting from fitting of ferrule 102 into sleeve 14 or the like. Accordingly, there is no need for alignment in a work of mounting optoelectronic device 28, i.e., LD 42 in housing 12.