发明申请
- 专利标题： Electronic device, rubber product, and methods for manufacturing the same
- 专利标题（中）： 电子装置，橡胶制品及其制造方法
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申请号： US10960074申请日： 2004-10-08
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公开(公告)号： US20050101060A1公开(公告)日： 2005-05-12
- 发明人: Shigeharu Tsunoda , Hiroshi Hozoji , Madoka Minagawa
- 申请人： Shigeharu Tsunoda , Hiroshi Hozoji , Madoka Minagawa
- 优先权： JP2003-348979 20031008
- 主分类号： G06K19/07
- IPC分类号： G06K19/07 ; G06K19/00 ; G06K19/077 ; H01L21/44 ; H01L25/00
摘要：
The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.
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