公开(公告)号：US08437584B2

公开(公告)日：2013-05-07

申请号：US12844452

申请日：2010-07-27

申请人： Yasunobu Matsuoka ,  Toshiki Sugawara ,  Koichiro Adachi ,  Naoki Matsushima ,  Saori Hamamura ,  Madoka Minagawa ,  Norio Chujo

发明人： Yasunobu Matsuoka ,  Toshiki Sugawara ,  Koichiro Adachi ,  Naoki Matsushima ,  Saori Hamamura ,  Madoka Minagawa ,  Norio Chujo

IPC分类号： G02B6/26 ,  G02B6/42

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/423 ,  H01S5/423 ,  Y10T29/49117

摘要： In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.

摘要翻译： 在制造光学I / O阵列模块时，在衬底上形成具有锥面的镜部分的光波导，凸形或凹形的部件位于 光波导，激光二极管阵列和具有凹形或凸形的光电二极管阵列在安装之前与凸形构件或凹形构件配合或配合。 此外，形成有多个膜层，其上集成有光学元件的驱动器IC LSI和光学元件的放大器LSI的LSI。

公开(公告)号：US06770547B1

公开(公告)日：2004-08-03

申请号：US09698186

申请日：2000-10-30

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L2120

CPC分类号： H01L23/3157 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device.

摘要翻译： 一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子 绝缘层并与半导体器件的电极电连接。

公开(公告)号：US20120128292A1

公开(公告)日：2012-05-24

申请号：US13382459

申请日：2010-06-02

申请人： Saori Hamamura ,  Naoki Matsushima ,  Madoka Minagawa ,  Satoshi Kaneko ,  Norio Chujo ,  Yasunobu Matsuoka ,  Toshiki Sugawara ,  Tsutomu Kono

发明人： Saori Hamamura ,  Naoki Matsushima ,  Madoka Minagawa ,  Satoshi Kaneko ,  Norio Chujo ,  Yasunobu Matsuoka ,  Toshiki Sugawara ,  Tsutomu Kono

IPC分类号： G02B6/12 ,  H01L33/48

CPC分类号： G02B6/4201 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4246 ,  G02B6/4257 ,  G02B6/428 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/3512 ,  Y10T29/49146

摘要： A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided.Optical devices 2a and 2b are disposed on a circuit board 1, so that they are optically coupled with optical guides 11 formed on the circuit board 1, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film 31, and an electric wiring layer 3 is laminated, so that the electrodes of the optical devices 2 and wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element 4; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing. Also, it has the structure of not causing deterioration of the optical devices due to ill influences of moisture, thereby achieving high reliability. Further, it also produces an easy connecting method with a transmission apparatus, and high productivity thereof.

摘要翻译： 提供了一种性能优良，批量生产率高的光电复合布线模块以及其中应用的发送装置。 光学器件2a和2b设置在电路板1上，使得它们与形成在电路板1上的光导11光学耦合，其中在凸起的侧表面上形成file状树脂，其形成在 光学元件的侧表面或/或上部在其上层被压缩以粘附在其上的树脂膜，从而形成绝缘膜31，并且层叠电布线层3，使得光学器件的电极 器件2和布线层的布线电连接，并且其上安装有半导体元件4; 从而获得用于使传输速度提高到每个通道高的结构，并且用于防止功耗增加。 此外，其具有不会由于湿气的不良影响而导致光学元件劣化的结构，从而实现高可靠性。 此外，它还产生与传动装置的简单连接方法，并且其生产率高。

公开(公告)号：US20110026878A1

公开(公告)日：2011-02-03

申请号：US12844452

申请日：2010-07-27

申请人： Yasunobu MATSUOKA ,  Toshiki Sugawara ,  Koichiro Adachi ,  Naoki Matsushima ,  Saori Hamamura ,  Madoka Minagawa ,  Norio Chujo

发明人： Yasunobu MATSUOKA ,  Toshiki Sugawara ,  Koichiro Adachi ,  Naoki Matsushima ,  Saori Hamamura ,  Madoka Minagawa ,  Norio Chujo

IPC分类号： G02B6/12 ,  G02B6/30 ,  H01R43/00

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/423 ,  H01S5/423 ,  Y10T29/49117

摘要： In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.

摘要翻译： 在制造光学I / O阵列模块时，在衬底上形成具有锥面的镜部分的光波导，凸形或凹形的部件位于 光波导，激光二极管阵列和具有凹形或凸形的光电二极管阵列在安装之前与凸形构件或凹形构件配合或配合。 此外，形成有多个膜层，其上集成有光学元件的驱动器IC LSI和光学元件的放大器LSI的LSI。

公开(公告)号：US07057283B2

公开(公告)日：2006-06-06

申请号：US10825436

申请日：2004-04-16

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/3157 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device. The electrically insulating layer is formed with a thickness so as to provide α-ray shielding of the semiconductor device.

摘要翻译： 一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子 绝缘层并与半导体器件的电极电连接。 电绝缘层形成为具有提供半导体器件的α射线屏蔽的厚度。

公开(公告)号：US20050230791A1

公开(公告)日：2005-10-20

申请号：US11075798

申请日：2005-03-10

申请人： Naoya Kanda ,  Madoka Minagawa ,  Kosuke Inoue ,  Hiroshi Homma

发明人： Naoya Kanda ,  Madoka Minagawa ,  Kosuke Inoue ,  Hiroshi Homma

IPC分类号： H01L21/60 ,  G06K19/077 ,  H01L21/607 ,  H01L23/495

CPC分类号： G06K19/07749 ,  G06K19/0775 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81395 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/00

摘要： When an RFID-tag is formed by joining a semiconductor chip (RFID chip) to an antenna consisting of a rolled metal foil or the like using ultrasonic waves, the pressure impressed to the semiconductor chip is suppressed to avoid the damage of the semiconductor chip. For this purpose, the present invention provides an RFID-tag 1 wherein gold bumps are joined to the metal foil by pressing the gold bumps formed on the semiconductor chip against an antenna member, and impressing ultrasonic waves; and the RFID-tag wherein a matte surface having a low glossiness is formed on the metal foil, or a surface having shallow rolling streaks is formed on the metal foil, and gold bumps are joined to the surface.

摘要翻译： 当通过使用超声波将半导体芯片（RFID芯片）接合到由轧制金属箔等构成的天线来形成RFID标签时，抑制了向半导体芯片施加的压力，以避免半导体芯片的损坏。 为此，本发明提供一种RFID标签1，其中通过将形成在半导体芯片上的金凸块压在天线构件上，并且施加超声波，将金凸块接合到金属箔上; 并且在金属箔上形成具有低光泽度的无光泽表面的RFID标签，或者在金属箔上形成具有浅轧条纹的表面，并且金凸块接合到表面。

公开(公告)号：US06835320B1

公开(公告)日：2004-12-28

申请号：US09786427

申请日：2001-03-06

申请人： Yoshinobu Komatsu ,  Hitoshi Ishida ,  Hiroshi Igarashi ,  Masami Kondo ,  Madoka Minagawa ,  Tetsu Sato ,  Teiji Sato

发明人： Yoshinobu Komatsu ,  Hitoshi Ishida ,  Hiroshi Igarashi ,  Masami Kondo ,  Madoka Minagawa ,  Tetsu Sato ,  Teiji Sato

IPC分类号： C01F776

CPC分类号： B01J41/10 ,  C01G9/00 ,  C01G9/006 ,  C01P2002/22 ,  C07F5/069

摘要： A composite metal polybasic salt containing a trivalent metal, zinc metal and a divalent metal as metal components and having a novel crystal structure, and a method of preparing the same. The invention further deals with a composite metal polybasic salt which has anion-exchanging property, which by itself is useful as an anion-exchanger, capable of introducing anions suited for the use upon anion-exchange, and finds a wide range of applications, and a method of preparing the same. The composite metal polybasic salt has a particular chemical composition and X-ray diffraction peaks, exhibiting peaks at 2&thgr;=2 to 15°, 2&thgr;=19.5 to 24° and 2&thgr;=33 to 50°, and a single peak at 2&thgr;=60 to 64° in the X-ray diffraction (Cu-&agr;).

摘要翻译： 含有三价金属，锌金属和二价金属作为金属成分并具有新颖晶体结构的复合金属多元盐及其制备方法。 本发明还涉及具有阴离子交换性质的复合金属多元盐，其本身可用作阴离子交换剂，能够引入适用于阴离子交换的阴离子，并且可广泛应用，并且 其制备方法。 复合金属多元盐具有特定的化学组成和X射线衍射峰，在2θ= 2°至15°，2θ= 19.5°至24°和2θ= 33°至50°处具有峰值，在2θ= 60°至60° 在X射线衍射（Cu-α）中为64°。

公开(公告)号：US06822317B1

公开(公告)日：2004-11-23

申请号：US09698168

申请日：2000-10-30

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L23495

CPC分类号： H01L23/3114 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3157 ,  H01L2224/05001 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus comprising a semiconductor device, an electrically insulating layer formed on the semiconductor device, and an external connection terminal formed on the electrically insulating layer and electrically connected to an electrode of the semiconductor device, wherein a power/ground line and a signal line in a region of from an edge of the electrically insulating layer to a uniform-thickness flat portion of the electrically insulating layer are different in kind of wiring pattern from each other.

摘要翻译： 一种半导体器件，包括半导体器件，形成在半导体器件上的电绝缘层和形成在电绝缘层上并与半导体器件的电极电连接的外部连接端子，其中电源/接地线和信号线 在从电绝缘层的边缘到电绝缘层的均匀厚度平坦部分的区域中，布线图案的种类不同。

公开(公告)号：US06683117B2

公开(公告)日：2004-01-27

申请号：US10056016

申请日：2002-01-28

申请人： Yoshinobu Komatsu ,  Hitoshi Ishida ,  Kouji Inoue ,  Hiroshi Igarashi ,  Masami Kondou ,  Madoka Minagawa ,  Tetsu Sato ,  Hiroshi Ogawa

发明人： Yoshinobu Komatsu ,  Hitoshi Ishida ,  Kouji Inoue ,  Hiroshi Igarashi ,  Masami Kondou ,  Madoka Minagawa ,  Tetsu Sato ,  Hiroshi Ogawa

IPC分类号： B01F1700

CPC分类号： A61K8/361 ,  A61K8/06 ,  A61K8/26 ,  A61Q19/00 ,  B01F17/0078 ,  B01F17/0085 ,  C07F5/069 ,  Y10S514/937

摘要： An oiliness agent comprising a carboxylate of a composite metal hydroxide having a chemical composition represented by the following general formula (1), M2aM3x(OH)y(A)z.nH2O  (1) wherein, M2 indicates a divalent metal, M3 indicates a trivalent metal, A indicates an anion of an aliphatic carboxylic acid, a, x, y, and z are numbers satisfying the following formulas: a>0, 3x+2a−y−mz=0 (wherein m is a valency of anion A), 0.3≦a/x≦2.5 1.5≦y/(a+x)≦3.0 1.0≦(a+x)/z≦20.0, and n is a number not larger than 7. The oiliness agent exhibits excellent emulsifying properties such as dispersion stability and moisture retaining property without emitting odor and without a tendency of being colored, and is very useful for forming a water-in-oil emulsion which can be effectively used as a base material for cosmetics.

摘要翻译： 1.一种油性剂，其含有具有下述通式（1）表示的化学组成的复合金属氢氧化物的羧酸盐，其中，M 2表示二价金属，M 3表示三价金属，A表示 脂族羧酸，a，x，y和z是满足下式的数字：n是不大于7的数。油性剂显示出优异的乳化性能，如分散稳定性和保湿性，而不发出气味，并且没有 着色的倾向，并且对于形成可有效用作化妆品的基础材料的油包水乳液是非常有用的。

公开(公告)号：US08401347B2

公开(公告)日：2013-03-19

申请号：US12623686

申请日：2009-11-23

申请人： Naoki Matsushima ,  Norio Chujo ,  Yasunobu Matsuoka ,  Toshiki Sugawara ,  Madoka Minagawa ,  Saori Hamamura ,  Satoshi Kaneko ,  Tsutomu Kono

发明人： Naoki Matsushima ,  Norio Chujo ,  Yasunobu Matsuoka ,  Toshiki Sugawara ,  Madoka Minagawa ,  Saori Hamamura ,  Satoshi Kaneko ,  Tsutomu Kono

IPC分类号： G02B6/12

CPC分类号： G02B6/4214 ,  H05K1/0274 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4644

摘要： A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI (device) having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.

摘要翻译： 光电复合布线模块包括电路基板，光学装置，具有用于光学装置的驱动器和放大器的LSI（器件）以及具有电布线的薄膜布线层。 光学器件通过电线与LSI连接。 光学器件形成在电路基板上，并且光耦合到形成在电路基板中的光波导。 在光学器件上形成薄膜布线层，以确保光学器件与薄膜布线层的电气布线电连接。 LSI与薄膜布线层安装在电连接上。