发明申请
- 专利标题： Chemical mechanical polishing pad
- 专利标题（中）： 化学机械抛光垫
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申请号： US10978472申请日： 2004-11-02
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公开(公告)号： US20050113011A1公开(公告)日： 2005-05-26
- 发明人: Hiroyuki Miyauchi , Hiroshi Shiho , Nobuo Kawahashi
- 申请人： Hiroyuki Miyauchi , Hiroshi Shiho , Nobuo Kawahashi
- 申请人地址： JP TOKYO
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP TOKYO
- 优先权： JP2003-374855 20031104
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B24B37/20 ; B24D11/00 ; B24D13/14 ; C09K3/14 ; B24B5/00
摘要：
A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the face and a side face for interconnecting these faces and including the pattern of recessed portions which are formed on the non-polishing face and are open to the non-polishing face and not to the side face.
公开/授权文献
- US07442116B2 Chemical mechanical polishing pad 公开/授权日：2008-10-28