The vacuum deposition device includes a vacuum deposition chamber, a vacuum evacuator for evacuating an inside of the chamber, an evaporating unit for evaporating one or more film forming materials in the chamber, a holding unit provided above the evaporating unit for holding a substrate for the vacuum deposition, and a preventing unit for preventing evaporated particles of the one or more materials from adhering to the substrate when the vacuum deposition is carried out at a pressure of 0.05 to 10 Pa. The pretreatment method for the vacuum deposition prepares the prevention unit in the chamber and melts the one or more materials by heating in the chamber at the pressure of 0.05 to 10 Pa while preventing the evaporated particles from adhering to the substrate by using the preventing unit.