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发明申请
US20050122198A1 Inductive device including bond wires 有权
感应装置包括接合线

Inductive device including bond wires
摘要：
An inductive device (105) is formed above a substrate (225) having a conductive coil formed around a core (109). The coil comprises segments formed from a first plurality of bond wires (113) and a second plurality of bond wires (111). The first plurality of bond wires (113) extends between the core (109) and the substrate (225). Each of the first plurality of bond wires is coupled to two of a plurality of wire bond pads (117, 116). The second plurality of bond wires (111) extends over the core (109) and is coupled between two of the plurality of wire bond pads (117, 119). A shield (141) includes a portion that is positioned between the core (109) and the substrate (225).
摘要（中）：

在具有围绕芯（109）形成的导电线圈的衬底（225）上方形成感应器件（105）。 线圈包括由第一多个接合线（113）和第二多个接合线（111）形成的线段。 第一多个接合线（113）在芯（109）和衬底（225）之间延伸。 第一多个接合线中的每一个耦合到多个引线接合焊盘（117,116）中的两个。 所述第二多个接合线（111）在所述芯（109）上方延伸并耦合在所述多个引线接合焊盘（117,119）中的两个之间。 屏蔽（141）包括位于芯（109）和衬底（225）之间的部分。

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