发明申请
- 专利标题: Ceramic chuck
- 专利标题(中): 陶瓷卡盘
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申请号: US11003285申请日: 2004-12-03
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公开(公告)号: US20050128674A1公开(公告)日: 2005-06-16
- 发明人: Tsuneaki Ohashi , Naohito Yamada , Hiroya Sugimoto
- 申请人: Tsuneaki Ohashi , Naohito Yamada , Hiroya Sugimoto
- 申请人地址: JP Nagoya-City
- 专利权人: NGK Insulators, Ltd.
- 当前专利权人: NGK Insulators, Ltd.
- 当前专利权人地址: JP Nagoya-City
- 优先权: JP2003-412712 20031211
- 主分类号: H01H1/00
- IPC分类号: H01H1/00 ; H01L21/68 ; H01L21/683 ; H02N13/00
摘要:
An object of the present invention is to provide a ceramic chuck for mounting a wafer so that the number of particles adhered onto the wafer after chucking can be reduced while maintaining a desired Young's Modulus of the chuck. A ceramic chuck 1 has a surface layer 2 contacting a wafer “W” and a substrate portion 6. The surface layer 2 and substrate portion 6 are produced by co-sintering and the surface layer 2 has a porosity of 1% or higher and 10% or lower and larger than that of the substrate portion 6.
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