摘要:
An object of the present invention is to provide a ceramic chuck for mounting a wafer so that the number of particles adhered onto the wafer after chucking can be reduced while maintaining a desired Young's Modulus of the chuck. A ceramic chuck 1 has a surface layer 2 contacting a wafer “W” and a substrate portion 6. The surface layer 2 and substrate portion 6 are produced by co-sintering and the surface layer 2 has a porosity of 1% or higher and 10% or lower and larger than that of the substrate portion 6.
摘要:
The present invention provides a sintered body of a joined body including two or more inorganic powder-molded bodies. The sintered body includes first components corresponding to the two or more inorganic powder-molded bodies in the joined body; and a second component corresponding to a junction in the joined body, and has one or both of the features (a) and (b): (a) the second component has a surface roughness equal to or lower than that of each of the first components; and (b) the second component has, in the vicinity of a width center thereof, a transmittance equal to or higher than that of each of the first components.
摘要:
The invention provides a film of an yttria-alumina complex oxide having a high peel strength with respect to a substrate. A mixed powder of powdery materials of yttria and alumina is sprayed on a substrate to form a sprayed film made of an yttria-alumina complex oxide. Preferably, the powdery material of yttria has a 50 percent mean particle diameter of not smaller than 0.1 μm and not larger than 100 μm, and the powdery material of alumina has a 50 percent mean particle diameter of not smaller than 0.1 μm and not larger than 100 μm. Preferably, the yttria-alumina complex oxide contains at least a garnet phase, and may further contain a perovskite phase.
摘要:
An electrostatic chuck and a method for manufacturing the same are provided. The electrostatic chuck has a bonded structure comprising a ceramic electrostatic chuck member, a metal member and a bonding layer. The bonding layer has at least a first outermost bonding layer joined to the ceramic electrostatic chuck member, a second outermost bonding layer joined to the metal member, and an intermediate polyimide layer disposed between the first and second outermost bonding layers. Each of the outermost bonding layers are made of a silicone layer or an acrylic.
摘要:
A halogen gas plasma-resistant member to be exposed to a halogen gas plasma, includes a main body of said member, and a corrosion-resistant film formed at least a surface of said main body, wherein a peeling resistance of the corrosive film to said main body is not less than 15 MPa.
摘要:
A silicon nitride sintered material includes a polycrystal material having silicon nitride crystal grains and a grain boundary phase. The sintered material contains a Yb element in an amount of 2 to 30% by weight in terms of its oxide and an Al element in an amount of 1 to 20% by weight in terms of its oxide and has a thermal conductivity of 40 W/mK or less at room temperature, a resistivity of 1×105 to 1×1012 &OHgr;·cm at room temperature, and a porosity of 0.5% or less.
摘要:
A novel method is provided for joining substrates made of aluminum nitride series ceramics to each other, which can perform the joining substantially without leaving an intervening third phase other than aluminum nitride series ceramics at the joining interface of the substrates. The method is performed, for example, by providing a joining agent 3 containing at least an aluminum nitride series ceramics and a flux between the substrates 1 and 2, heat treating the joining agent to eutectically melt the aluminum nitride series ceramics and the flux, then precipitating a reprecipitated phase of the aluminum nitride series ceramics at the joining interface of the substrates. Alternatively, the method is performed by providing a joining agent 3 containing at least an aluminum nitride series ceramics and a flux between the substrates 1 and 2, heating the joining agent to a temperature range T1 which is higher than the melting point of the flux, subsequently heating the joining agent to a temperature range T2 which is higher than the temperature range T1 to exit the components of the flux from the joining interface, ten precipitating the reprecipitated phase of the aluminum nitride series ceramics at the joining interface.
摘要:
A heat resistant, low expansion phosphate compound and sintered bodies thereof, having a composition of RZr.sub.4 P.sub.6 O.sub.24 (R is one or more cations of IIa group in the periodic table, such as Ba, Sr and Ca): an average thermal expansion coefficient between room temperature and 1,400.degree. C. of -10.about.+10.times.10.sup.-7 /.degree.C.; and having a high temperature type crystalline structure having R3c symmetry at room temperature. The sintered body of the invention can be manufactured by mixing and shaping starting materials, firing the resulting shaped body at 1,400.degree. C..about.1,700.degree. C. to provide a sintered body with a composition of RZr.sub.4 P.sub.6 O.sub.24 and then, keeping the obtained sintered body at a high temperature of not lower than a temperature of phase transition between a high temperature type and a low temperature type crystalline structure, followed by quenching.
摘要:
Heat-resisting phosphate based compound sintered bodies are disclosed, which each contain not less than 10% by weight of a crystalline phase of RZr.sub.4 (PO.sub.4).sub.6 in which R is an element in Group IIa of the Periodic Table. A weight-reduced percentage of the sintered body when being thermally treated at 1,400.degree. C. for 100 hours is not more than 10%. A process for producing such phosphate based compound sintered bodies is also disclosed.
摘要:
Heat resisting low expansion zirconyl phosphate-zircon composite bodies are disclosed, which contain zirconyl phosphate and zircon as a main crystalline phase and a secondary crystalline phase, respectively. The heat resisting low expansion zirconyl phosphate-zircon composite bodies have a coefficient of thermal expansion in a temperature range from room temperature to 1,400.degree. C. being not more than 30.times.10-7/.degree. C. and a melting point being not less than 1,600.degree. C. The composite bodies have a chemical composition essentially consisting of 58.2 to 65.4% by weight of ZrO.sub.2, 17.4 to 37.1% by weight of P.sub.2 O.sub.5, and 1.5 to 19.0% by weight of SiO.sub.2. The heat resisting low expansion zirconyl phosphate-zircon composite bodies optionally contain MgO and Al.sub.2 O.sub.3 in a total amount of not more than 2.5% by weight or 0.1 to 4% by weight of Nb.sub.2 O.sub.5. A process for producing such zirconyl phosphate-zircon composite bodies is also disclosed.
摘要翻译:公开了耐热低膨胀性磷酸锆锆石复合体,其分别含有磷酸锆和锆石作为主结晶相和二次结晶相。 耐热低膨胀型磷酸锆锆锆复合体的体系在室温〜1400℃的温度范围内的热膨胀系数为30×10 -7 /℃以下,熔点为1600℃以上 复合体具有基本上由58.2至65.4重量%的ZrO 2,17.4至37.1重量%的P 2 O 5和1.5至19.0重量%的SiO 2组成的化学组成。 耐热低膨胀性磷酸锆锆锆复合体任意地含有MgO和Al 2 O 3,其总量不超过2.5重量%或0.1〜4重量%的Nb 2 O 5。 还公开了一种制备这种磷酸锆锆石复合体的方法。