发明申请
- 专利标题： Power module with heat exchange
- 专利标题（中）： 电源模块具有热交换功能
-
申请号： US10738926申请日： 2003-12-16
-
公开(公告)号： US20050128706A1公开(公告)日： 2005-06-16
- 发明人: Douglas Maly , Kanghua Chen , Ajay Patwardhan , Sayeed Ahmed , Pablo Rodriguez , Gerardo Jimenez
- 申请人： Douglas Maly , Kanghua Chen , Ajay Patwardhan , Sayeed Ahmed , Pablo Rodriguez , Gerardo Jimenez
- 申请人地址： US MI Dearborn
- 专利权人： Ballard Power Systems Corporation
- 当前专利权人： Ballard Power Systems Corporation
- 当前专利权人地址： US MI Dearborn
- 主分类号： H01L23/427
- IPC分类号： H01L23/427 ; H01L23/473 ; H01L25/07 ; H05K7/14 ; H05K7/20
摘要：
A power module comprises first and second substrates carrying semiconductor devices and coupled to respective pluralities of heat exchange members without intervening thermally insulative structures. One or more heat exchange loops circulate a heat exchange medium thermally coupled to the heat exchange members. Substrates may function as integral bus bars.
公开/授权文献
- US1685901A Binder 公开/授权日：1928-10-02
信息查询
IPC分类:
