公开(公告)号：US20050152100A1

公开(公告)日：2005-07-14

申请号：US11003542

申请日：2004-12-03

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00 ,  H02B5/00 ,  H02M7/00 ,  H05K7/14

CPC分类号： H05K7/1432 ,  H02M7/003 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US06845017B2

公开(公告)日：2005-01-18

申请号：US09957568

申请日：2001-09-20

申请人： Sayeed Ahmed ,  Scott Parkhill ,  Fred Flett ,  Douglas Maly

发明人： Sayeed Ahmed ,  Scott Parkhill ,  Fred Flett ,  Douglas Maly

IPC分类号： H01L23/66 ,  H01L25/07 ,  H05K1/02 ,  H05K1/03 ,  H01R9/00

CPC分类号： H01L25/072 ,  H01L23/50 ,  H01L23/66 ,  H01L2223/665 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0215 ,  H05K1/0237 ,  H05K1/0306 ,  H05K2201/09345 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00

摘要： A DC bus for use in a power module includes a positive DC conductor bus plate parallel with a negative DC conductor bus plate. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

摘要翻译： 用于功率模块的DC总线包括与负DC导体总线板平行的正直流导体母线板。 正母线和负母线允许电流逆流，从而消除磁场及其相关的电感，正负母线可连接到电源模块的中心部分。

公开(公告)号：US20060007721A1

公开(公告)日：2006-01-12

申请号：US11010950

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。

公开(公告)号：US20050128706A1

公开(公告)日：2005-06-16

申请号：US10738926

申请日：2003-12-16

申请人： Douglas Maly ,  Kanghua Chen ,  Ajay Patwardhan ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Gerardo Jimenez

发明人： Douglas Maly ,  Kanghua Chen ,  Ajay Patwardhan ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Gerardo Jimenez

IPC分类号： H01L23/427 ,  H01L23/473 ,  H01L25/07 ,  H05K7/14 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L23/427 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K7/20927 ,  H05K7/20936 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A power module comprises first and second substrates carrying semiconductor devices and coupled to respective pluralities of heat exchange members without intervening thermally insulative structures. One or more heat exchange loops circulate a heat exchange medium thermally coupled to the heat exchange members. Substrates may function as integral bus bars.

摘要翻译： 功率模块包括承载半导体器件的第一和第二衬底，并且耦合到相应的多个热交换构件，而没有中间的绝热结构。 一个或多个热交换回路循环热耦合到热交换构件的热交换介质。 基板可用作集成母线。

公开(公告)号：US20050287402A1

公开(公告)日：2005-12-29

申请号：US10876267

申请日：2004-06-23

申请人： Douglas Maly ,  Bruce Lin

发明人： Douglas Maly ,  Bruce Lin

IPC分类号： H01M8/00 ,  H01M8/04 ,  H01M8/10

CPC分类号： H01M8/04291 ,  H01M8/04492 ,  H01M8/04552 ,  H01M8/04559 ,  H01M8/04567 ,  H01M8/04597 ,  H01M8/04649 ,  H01M8/04828 ,  H01M8/04992 ,  H01M2008/1095

摘要： A ripple voltage, caused by a voltage inverter, is superimposed on an output voltage provided by a fuel cell stack. This ripple voltage is sensed and used to determine an AC impedance of the fuel cell stack. The determined AC impedance can be correlated to a hydration state of the fuel cell stack.

摘要翻译： 由电压逆变器引起的纹波电压叠加在由燃料电池堆提供的输出电压上。 该纹波电压被感测并用于确定燃料电池堆的AC阻抗。 所确定的AC阻抗可以与燃料电池堆的水合状态相关。

公开(公告)号：US20050152101A1

公开(公告)日：2005-07-14

申请号：US11010560

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02B5/00

CPC分类号： H02M7/003 ,  H02M2001/327 ,  H05K7/20272 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US06636429B2

公开(公告)日：2003-10-21

申请号：US09957001

申请日：2001-09-20

申请人： Douglas Maly ,  Sayeed Ahmed ,  Scott Parkhill ,  Fred Flett

发明人： Douglas Maly ,  Sayeed Ahmed ,  Scott Parkhill ,  Fred Flett

IPC分类号： H05K900

CPC分类号： H05K1/0231 ,  H01L23/50 ,  H01L23/66 ,  H01L25/072 ,  H01L2223/665 ,  H01L2924/0002 ,  H01L2924/01039 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0215 ,  H05K1/0237 ,  H05K1/0306 ,  H05K2201/09345 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00

摘要： A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference (“EMI”). In one embodiment, capacitance is electrically connected to at least one of the positive conducting layer in a substrate or the negative conducting layer in a substrate and a ground. Integrating a capacitive network of low stray inductance in a substrate of a power module allows relatively small, inexpensive capacitors to be used.

公开(公告)号：US20060274561A1

公开(公告)日：2006-12-07

申请号：US10658804

申请日：2003-09-09

申请人： Sayeed Ahmed ,  Fred Flett ,  Ajay Patwardhan ,  Douglas Maly

发明人： Sayeed Ahmed ,  Fred Flett ,  Ajay Patwardhan ,  Douglas Maly

IPC分类号： H02M7/5387

CPC分类号： H02M7/53871 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H02M7/003 ,  H02M7/487 ,  H01L2924/00014

摘要： A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

公开(公告)号：US20060062023A1

公开(公告)日：2006-03-23

申请号：US10945850

申请日：2004-09-21

申请人： Ajay Patwardhan ,  Douglas Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

发明人： Ajay Patwardhan ,  Douglas Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

IPC分类号： H02J1/00

CPC分类号： H02M7/797 ,  H02M7/757

摘要： A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

摘要翻译： 一种电力转换器，包括电耦合在正和负DC总线端子与一组相位端子之间的DC / AC桥式电路，DC / DC桥式电路电耦合到正负DC总线端子和一组DC桥式端子。 功率转换器可以被配置为控制到DC桥接端子和/或从DC桥接端子的转移和控制向AC相端子和/或从AC相端子的功率传递。

公开(公告)号：US20050162875A1

公开(公告)日：2005-07-28

申请号：US11010561

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。