公开(公告)号：US20080296075A1

公开(公告)日：2008-12-04

申请号：US11755296

申请日：2007-05-30

申请人： Douglas Zhu ,  Sarav Paramasivam ,  David Patel ,  Patrick Maguire ,  Kanghua Chen

发明人： Douglas Zhu ,  Sarav Paramasivam ,  David Patel ,  Patrick Maguire ,  Kanghua Chen

IPC分类号： B60K11/06 ,  B60K11/08

CPC分类号： B60K1/04 ,  B60K2001/005 ,  B60K2001/0416 ,  B60N2/5621 ,  B60N2/646

摘要： A battery of a vehicle is cooled by air from a cabin of the vehicle. The air from the cabin flows underneath a rear seat of the vehicle and to the battery.

摘要翻译： 车辆的电池由来自车辆的舱室的空气冷却。 客舱内的空气流过车辆后排座椅和电池。

公开(公告)号：US20060062023A1

公开(公告)日：2006-03-23

申请号：US10945850

申请日：2004-09-21

申请人： Ajay Patwardhan ,  Douglas Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

发明人： Ajay Patwardhan ,  Douglas Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

IPC分类号： H02J1/00

CPC分类号： H02M7/797 ,  H02M7/757

摘要： A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

摘要翻译： 一种电力转换器，包括电耦合在正和负DC总线端子与一组相位端子之间的DC / AC桥式电路，DC / DC桥式电路电耦合到正负DC总线端子和一组DC桥式端子。 功率转换器可以被配置为控制到DC桥接端子和/或从DC桥接端子的转移和控制向AC相端子和/或从AC相端子的功率传递。

公开(公告)号：US20050162875A1

公开(公告)日：2005-07-28

申请号：US11010561

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。

公开(公告)号：US09126477B2

公开(公告)日：2015-09-08

申请号：US11755296

申请日：2007-05-30

申请人： Douglas Zhu ,  Sarav Paramasivam ,  David Patel ,  Patrick Maguire ,  Kanghua Chen

发明人： Douglas Zhu ,  Sarav Paramasivam ,  David Patel ,  Patrick Maguire ,  Kanghua Chen

IPC分类号： B60K11/06 ,  B60K1/04 ,  B60N2/64 ,  B60K1/00

CPC分类号： B60K1/04 ,  B60K2001/005 ,  B60K2001/0416 ,  B60N2/5621 ,  B60N2/646

摘要： A battery of a vehicle is cooled by air from a cabin of the vehicle. The air from the cabin flows underneath a rear seat of the vehicle and to the battery.

摘要翻译： 车辆的电池由来自车辆的舱室的空气冷却。 客舱内的空气流过车辆后排座椅和电池。

公开(公告)号：US07292451B2

公开(公告)日：2007-11-06

申请号：US11010950

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H01R9/00

CPC分类号： H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US07289329B2

公开(公告)日：2007-10-30

申请号：US10964000

申请日：2004-10-12

申请人： Kanghua Chen ,  Sayeed Ahmed ,  Lizhi Zhu

发明人： Kanghua Chen ,  Sayeed Ahmed ,  Lizhi Zhu

IPC分类号： H05K7/20 ,  H01F27/08

CPC分类号： H01F27/2804 ,  H01F27/22 ,  H01L23/645 ,  H01L25/16 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.

摘要翻译： 功率转换器集成至少一个平面变压器，其包括多层变压器基板和/或至少一个平面电感器，其包括具有多个功率半导体开关的多层电感器基板，多个功率半导体开关通过一个或多个物理和热耦合到散热器 多层开关基板。

公开(公告)号：US20050270745A1

公开(公告)日：2005-12-08

申请号：US10964000

申请日：2004-10-12

申请人： Kanghua Chen ,  Sayeed Ahmed ,  Lizhi Zhu

发明人： Kanghua Chen ,  Sayeed Ahmed ,  Lizhi Zhu

IPC分类号： H01F27/22 ,  H01F27/28 ,  H02M7/00 ,  H05K7/20

CPC分类号： H01F27/2804 ,  H01F27/22 ,  H01L23/645 ,  H01L25/16 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.

摘要翻译： 功率转换器集成至少一个平面变压器，其包括多层变压器基板和/或至少一个平面电感器，其包括具有多个功率半导体开关的多层电感器基板，多个功率半导体开关通过一个或多个物理和热耦合到散热器 多层开关基板。

公开(公告)号：US20050152101A1

公开(公告)日：2005-07-14

申请号：US11010560

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02B5/00

CPC分类号： H02M7/003 ,  H02M2001/327 ,  H05K7/20272 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US07046535B2

公开(公告)日：2006-05-16

申请号：US11003542

申请日：2004-12-03

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H05K7/1432 ,  H02M7/003 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US07289343B2

公开(公告)日：2007-10-30

申请号：US11010560

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H02M7/003 ,  H02M2001/327 ,  H05K7/20272 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。