发明申请
- 专利标题： Stress dispersing lead and stress dispersing method of lead
- 专利标题（中）： 铅的应力分散铅和应力分散法
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申请号： US10990380申请日： 2004-11-18
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公开(公告)号： US20050130497A1公开(公告)日： 2005-06-16
- 发明人: Yoshihiro Asakura , Kenya Kamijo , Akihiro Nakanishi , Toshihiko Watanabe , Toru Aihara
- 申请人： Yoshihiro Asakura , Kenya Kamijo , Akihiro Nakanishi , Toshihiko Watanabe , Toru Aihara
- 优先权： JP388158/2003 20031118
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01J1/00 ; H01L23/495 ; H01L23/498 ; H01L25/10 ; H05K3/34
摘要：
On a printed circuit board, there are mounted a pair of first leads, a first semiconductor device mounted on each of the first leads, a pair of second leads, and a second semiconductor device mounted on each of the second leads. A semiconductor device connecting terminal portion of each of the first leads extends to an outer side from the first semiconductor device, and one end of an intermediate slope portion of each of the first leads is bent to an inner side, whereby a substrate connecting terminal portion is structured. Accordingly, since an entire length of each of the first leads is elongated, a stress is absorbed dispersedly, and a tape carrier package is made compact.