发明申请
- 专利标题: Blasting materials and method of blasting
- 专利标题(中): 爆破材料和爆破方法
-
申请号: US10504304申请日: 2003-02-12
-
公开(公告)号: US20050130564A1公开(公告)日: 2005-06-16
- 发明人: Yasuhito Inagaki , Tetsuya Komine , Masahiro Sawaguchi , Daisuke Hasegawa
- 申请人: Yasuhito Inagaki , Tetsuya Komine , Masahiro Sawaguchi , Daisuke Hasegawa
- 申请人地址: JP Tokyo 141-0032
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo 141-0032
- 优先权: JP2002-034607 20020212; JP2002-034611 20020212; JP2002-096980 20020329
- 国际申请: PCT/JP03/01433 WO 20030212
- 主分类号: B24C11/00
- IPC分类号: B24C11/00 ; C09K3/14 ; B24B1/00 ; B24C1/00
摘要:
It is an object of the present invention to provide a blasting method and a shot material, which are very practical both in the cost and the treatment performance. (a) A shot material containing a styrene ion-exchange resin or a waste material caused therefrom, or/and a dried sludge-derived material, (b) a shot material containing a resin which is comprised of a resin containing a rubber component and a resin containing no rubber component, and (c) a shot material containing at least one component selected from the group consisting of an epoxy resin composition and inorganic filler, and a blasting method using the shot material.
公开/授权文献
- US07220165B2 Blasting materials and method of blasting 公开/授权日:2007-05-22
信息查询