发明申请
US20050133563A1 Wire bonding apparatus and method for clamping a wire 有权
导线接合装置和夹紧线的方法

Wire bonding apparatus and method for clamping a wire
摘要:
A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.
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