公开(公告)号：US07481351B2

公开(公告)日：2009-01-27

申请号：US10928402

申请日：2004-08-30

Applicant: Tae-Hyun Kim ,  Youn-Sung Ko ,  Young-Kyun Sun ,  Dae-Soo Kim ,  Kook-Jin Oh ,  Sang-Woo Lee ,  Dong-Bin Kim

Inventor： Tae-Hyun Kim ,  Youn-Sung Ko ,  Young-Kyun Sun ,  Dae-Soo Kim ,  Kook-Jin Oh ,  Sang-Woo Lee ,  Dong-Bin Kim

IPC: B23K31/02 ,  B23K37/04

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/7865 ,  H01L2224/789 ,  H01L2224/78901 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.

Abstract translation: 控制器可以从引线接合监测系统接收线断线信号，并且操作线夹以夹紧断开的线。 可以自动执行一系列操作，其可以包括拉丝操作，线尾成型操作和滚珠成形操作。 传感器可以测量通过毛细管拉出的丝的长度和可以形成在丝尾的球的位置。 辅助夹具可以安装在线夹和毛细管之间，用于使用传感器信息绘制线。

公开(公告)号：US20050280503A1

公开(公告)日：2005-12-22

申请号：US11147314

申请日：2005-06-08

Applicant: Sang-Woo Lee ,  Cheol-Joon Yoo ,  Dong-Bin Kim

Inventor： Sang-Woo Lee ,  Cheol-Joon Yoo ,  Dong-Bin Kim

IPC: H01L21/02 ,  H01L23/544 ,  H04Q5/22

CPC classification number: H01L23/544 ,  H01L2223/54413 ,  H01L2223/54446 ,  H01L2223/54493 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor wafer, comprising a radio frequency identification (RFID) chip on one side of the semiconductor wafer, on which a pattern has been formed, wherein information on the wafer is input to and/or output from the RFID chip using radio frequency communication.

Abstract translation: 一种半导体晶片，包括在其上形成图案的半导体晶片的一侧上的射频识别（RFID）芯片，其中晶片上的信息被使用射频通信输入到和/或从RFID芯片输出。

公开(公告)号：US20050133563A1

公开(公告)日：2005-06-23

申请号：US10928402

申请日：2004-08-30

Applicant: Tae-Hyun Kim ,  Youn-Sung Ko ,  Young-Kyun Sun ,  Dae-Soo Kim ,  Kook-Jin Oh ,  Sang-Woo Lee ,  Dong-Bin Kim

Inventor： Tae-Hyun Kim ,  Youn-Sung Ko ,  Young-Kyun Sun ,  Dae-Soo Kim ,  Kook-Jin Oh ,  Sang-Woo Lee ,  Dong-Bin Kim

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/607 ,  B23K37/00 ,  B23K1/06

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/7865 ,  H01L2224/789 ,  H01L2224/78901 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.

Abstract translation: 控制器可以从引线接合监测系统接收线断线信号，并且操作线夹以夹紧断开的线。 可以自动执行一系列操作，其可以包括拉丝操作，线尾成型操作和滚珠成形操作。 传感器可以测量通过毛细管拉出的丝的长度和可以形成在丝尾的球的位置。 辅助夹具可以安装在线夹和毛细管之间，用于使用传感器信息绘制线。

公开(公告)号：US20050269713A1

公开(公告)日：2005-12-08

申请号：US11047569

申请日：2005-02-02

Applicant: Kook-Jin Oh ,  Dae-Soo Kim ,  Dong-Bin Kim ,  Suk-Chun Jung ,  Sang-Woo Lee ,  Byung-Soo Kim

Inventor： Kook-Jin Oh ,  Dae-Soo Kim ,  Dong-Bin Kim ,  Suk-Chun Jung ,  Sang-Woo Lee ,  Byung-Soo Kim

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/58 ,  H01L23/48 ,  H01L23/544

CPC classification number: B23K20/004 ,  H01L23/544 ,  H01L24/45 ,  H01L24/75 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L2223/54473 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/78 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2224/48 ,  H01L2924/00

Abstract: An apparatus and method for wire bonding and die attaching using a system for determining reject frames by determining a z-level distance using a z-axis sensor are provided. The apparatus includes a z-axis sensor that may be moved between a reference position and an upper surface of frames on a PCB; a z-axis sensor controller for positioning and moving the z-axis sensor relative to the frame to measure the z-level distance between the reference position and a z-axis sensor contact position on an upper surface of the frame; and a host controller for determining whether the frame is a reject frame by comparing the measured z-level distance with a reference level. The apparatus and method provides for the dynamic determination of which frames are suitable for additional processing with a low error rate and thereby increase the exclusion rate for reject frames resulting in increased production capacity.

Abstract translation: 提供了一种使用用于通过使用z轴传感器确定z级距离来确定拒绝帧的系统进行引线接合和管芯附接的装置和方法。 该装置包括可在PCB上的基准位置和框架的上表面之间移动的z轴传感器; z轴传感器控制器，用于相对于框架定位和移动z轴传感器，以测量参考位置与框架上表面上的z轴传感器接触位置之间的z级距离; 以及主机控制器，用于通过将测量的z级距离与参考电平进行比较来确定帧是否是拒绝帧。 该装置和方法提供动态确定哪些帧适合于具有低错误率的附加处理，从而增加拒绝帧的排除率，从而提高生产能力。

公开(公告)号：US06578567B2

公开(公告)日：2003-06-17

申请号：US09998771

申请日：2001-11-29

Applicant: Joung-Min Oh ,  Dong-Bin Kim ,  Sung-Hee Lee ,  Byeong-Soo Kim

Inventor： Joung-Min Oh ,  Dong-Bin Kim ,  Sung-Hee Lee ,  Byeong-Soo Kim

IPC: B28D108

CPC classification number: B28D5/0094 ,  B28D5/0064 ,  G05B2219/45031 ,  G05B2219/45044 ,  G05B2219/49075 ,  Y10T83/088 ,  Y10T83/089 ,  Y10T83/7763

Abstract: A wafer sawing apparatus comprises an electrically conductive chuck table surrounding a suction plate and tactile sensing lines formed on the upper surface of the suction plate. At least one end of each tactile sensing line is electrically connected to the table body. A controller controls the chuck table and a scribing blade. The controller is electrically connected to both elements. The controller comprises a tactile sensing unit connected to the table body for sensing contact of the scribing blade with the tactile sensing lines or the table body and an equipment stop unit for stopping the scribing blade. The controller further comprises a zero point adjusting unit for receiving a contact signal from the tactile sensing unit and for adjusting a zero point of the scribing blade, and a switching unit connecting the tactile sensing unit to the zero point adjusting unit or the equipment stop unit.