发明申请
US20050133823A1 Method and apparatus for forming a wiring, wiring board, and ink set
审中-公开
用于形成布线，布线板和墨水组的方法和装置
- 专利标题： Method and apparatus for forming a wiring, wiring board, and ink set
- 专利标题（中）： 用于形成布线，布线板和墨水组的方法和装置
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申请号： US11000012申请日： 2004-12-01
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公开(公告)号： US20050133823A1公开(公告)日： 2005-06-23
- 发明人: Takashi Mori , Kazuo Iwata , Yuji Tsuruoka , Osamu Nishiwaki , Hidehito Takayama , Eiichi Motai
- 申请人： Takashi Mori , Kazuo Iwata , Yuji Tsuruoka , Osamu Nishiwaki , Hidehito Takayama , Eiichi Motai
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 优先权： JP2003-424988 20031222
- 主分类号： H01L21/288
- IPC分类号： H01L21/288 ; H05K3/10 ; H05K3/12 ; H05K3/46 ; H05K1/09
摘要：
A method for forming a wiring according to the present invention includes supplying to a substrate a first liquid containing a first component to form a first pattern and a second liquid containing a second component to form a second pattern to come into contact with each other, the second component causing interfacial aggregation in a contact area with the first component when brought into contact with the first component, and forming a wiring pattern consisting of the first pattern and the second pattern on the substrate.