发明申请
- 专利标题： Semiconductor light emitting device
- 专利标题（中）： 半导体发光器件
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申请号： US11013617申请日： 2004-12-15
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公开(公告)号： US20050133939A1公开(公告)日： 2005-06-23
- 发明人: Hiroshi Chikugawa , Yoshihiko Yamamoto , Eiji Kametani
- 申请人： Hiroshi Chikugawa , Yoshihiko Yamamoto , Eiji Kametani
- 申请人地址： JP Osaka-shi 545-8522
- 专利权人： SHARP KABUSHIKI KAISHA
- 当前专利权人： SHARP KABUSHIKI KAISHA
- 当前专利权人地址： JP Osaka-shi 545-8522
- 优先权： JPJP2003-419585 20031217
- 主分类号： F21V29/00
- IPC分类号： F21V29/00 ; F21V1/00 ; F21Y101/02 ; H01L33/60 ; H01L33/62 ; H01L33/64
摘要：
A light emitting element is die-bonded to a portion of a lead frame exposed at the bottom of an opening formed at a top face of a resin package. A reflector to direct light emitted from the light emitting element towards a predetermined direction is attached to the top face of the resin package. Lead terminals are arranged so as to protrude from two opposite side regions of the resin package. A predetermined lead terminal among the plurality of lead terminals, connected to a portion where the light emitting element is die-bonded, is bent upwards, and soldered to the reflector by solder paste.
公开/授权文献
- US07282740B2 Semiconductor light emitting device 公开/授权日：2007-10-16
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