发明申请
US20050145958A1 Formation of a disposable spacer to post dope a gate conductor
失效
一次性间隔件的形成以喷涂一个栅极导体
- 专利标题: Formation of a disposable spacer to post dope a gate conductor
- 专利标题(中): 一次性间隔件的形成以喷涂一个栅极导体
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申请号: US10752386申请日: 2004-01-06
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公开(公告)号: US20050145958A1公开(公告)日: 2005-07-07
- 发明人: David Horak , Toshiharu Furukawa , Akihisa Sekiguchi
- 申请人: David Horak , Toshiharu Furukawa , Akihisa Sekiguchi
- 申请人地址: US NY ARMONK
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY ARMONK
- 主分类号: H01L21/28
- IPC分类号: H01L21/28 ; H01L21/336 ; H01L29/76 ; H01L29/78
摘要:
A method of forming a doped gate structure on a semiconductor device and a semiconductor structure formed in that method are provided. The method comprises the steps of providing a semiconductor device including a gate dielectric layer, and forming a gate stack on said dielectric layer. This latter step, in turn, includes the steps of forming a first gate layer on the dielectric layer, and forming a second disposable layer on top of the first gate layer. A fat spacer is formed around the first gate layer and the second layers. The second disposable layer is removed, and ions are implanted in the first gate layer to supply additional dopant into the gate above the gate dielectric layer, while the fat disposable spacer keeps the implanted ions away from the critical source and drain diffusion region.
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