发明申请
- 专利标题： Plasma processing method and plasma processing apparatus
- 专利标题（中）： 等离子体处理方法和等离子体处理装置
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申请号： US11055612申请日： 2005-02-11
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公开(公告)号： US20050146709A1公开(公告)日： 2005-07-07
- 发明人: Hin Oh , Hideaki Sato , Naoki Takayama , Hisanori Sakai , Yuichi Mimura
- 申请人： Hin Oh , Hideaki Sato , Naoki Takayama , Hisanori Sakai , Yuichi Mimura
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2002-235942 20020813; JP2002-235973 20020813
- 主分类号： G01J3/28
- IPC分类号： G01J3/28 ; G01J3/30 ; H01J37/32 ; H01L21/3065
摘要：
In a plasma processing method and apparatus for monitoring information on a plasma processing, a multivariate analysis is performed by using as analysis data detection values detected for each object to be processed from a plurality of detection devices disposed in the processing apparatus upon the plasma processing. At that time, for each of sections defined whenever a maintenance of the processing apparatus is carried out, the detection values detected by the detection devices in the respective sections are compensated through a compensation unit, and the compensated detection values are taken as the analysis data.
公开/授权文献
- US06985215B2 Plasma processing method and plasma processing apparatus 公开/授权日：2006-01-10
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